Product Line | Thermally Conductive |
---|---|
PS:Markets | Electronics, Aerospace & Defense, Optical & Telecom |
PS:Application | Bonding, Sealing, Underfill |
PS:Flexibility | Hard & Rigid |
PS:Cure Condition | 80°C – 150°C |
PS:Viscosity | Thick/ Paste |
PS:Conductivity | Thermally Conductive Electrically Insulating |
PS:Certifications & Test Standards | |
Datasheet | H74F.pdf |
SDS | H74F SDS.pdf |
Syringe | N/A |
Related Brochure | EPO-TEK® Adhesives Applications (PCB).pdf |
