H74F

Product Line

Thermally Conductive

PS:Markets

Electronics, Aerospace & Defense, Optical & Telecom

PS:Application

Bonding, Sealing, Underfill

PS:Flexibility

Hard & Rigid

PS:Cure Condition

80°C – 150°C

PS:Viscosity

Thick/ Paste

PS:Conductivity

Thermally Conductive Electrically Insulating

PS:Certifications & Test Standards
Datasheet

H74F.pdf

SDS

H74F SDS.pdf

Syringe

N/A

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