| Product Line | Thermally Conductive |
|---|---|
| PS:Markets | Electronics, Aerospace & Defense, Optical & Telecom |
| PS:Application | Bonding, Sealing, Underfill |
| PS:Flexibility | Hard & Rigid |
| PS:Cure Condition | 80°C – 150°C |
| PS:Viscosity | Thick/ Paste |
| PS:Conductivity | Thermally Conductive Electrically Insulating |
| PS:Certifications & Test Standards | |
| Datasheet | H74F.pdf |
| SDS | H74F SDS.pdf |
| Syringe | N/A |
| Related Brochure | EPO-TEK® Adhesives Applications (PCB).pdf |
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