| Product Line | Thermally Conductive |
|---|---|
| PS:Markets | Electronics, Optical & Telecom, Oil & Renewable Energy, Aerospace & Defense |
| PS:Application | Bonding, Underfill, Sealing |
| PS:Flexibility | Hard & Rigid |
| PS:Cure Condition | 80°C – 150°C |
| PS:Viscosity | Thick/ Paste |
| PS:Conductivity | Thermally Conductive Electrically Insulating |
| PS:Certifications & Test Standards | ASTM E595 |
| Datasheet | H72.pdf |
| SDS | H72 SDS.pdf |
| Syringe | H72 PMF Syringe.pdf |
| Related Brochure | EPO-TEK® Low Outgassing Adhesives.pdf |
