| Product Line | Thermally Conductive |
|---|---|
| PS:Markets | Aerospace & Defense, Electronics, Optical & Telecom |
| PS:Application | Bonding, Potting & Encapsulation |
| PS:Flexibility | Hard & Rigid |
| PS:Cure Condition | 80°C – 150°C |
| PS:Viscosity | Medium, Thick/ Paste |
| PS:Conductivity | Thermally Conductive Electrically Insulating |
| PS:Certifications & Test Standards | |
| Datasheet | H70S.pdf |
| SDS | H70S SDS.pdf |
| Syringe | H70S PMF Syringe.pdf |
| Related Brochure | EPO-TEK® Adhesives Applications (PCB).pdf |
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