Product Line | Thermally Conductive |
---|---|
PS:Markets | Aerospace & Defense, Electronics, Optical & Telecom |
PS:Application | Bonding, Potting & Encapsulation |
PS:Flexibility | Hard & Rigid |
PS:Cure Condition | 80°C – 150°C |
PS:Viscosity | Medium, Thick/ Paste |
PS:Conductivity | Thermally Conductive Electrically Insulating |
PS:Certifications & Test Standards | |
Datasheet | H70S.pdf |
SDS | H70S SDS.pdf |
Syringe | H70S PMF Syringe.pdf |
Related Brochure | EPO-TEK® Adhesives Applications (PCB).pdf |
