| Product Line | Thermally Conductive |
|---|---|
| PS:Markets | Electronics, Optical & Telecom, Aerospace & Defense, Oil & Renewable Energy |
| PS:Application | Bonding, Sealing |
| PS:Flexibility | Hard & Rigid |
| PS:Cure Condition | 150°C – 200°C |
| PS:Viscosity | Thick/ Paste |
| PS:Conductivity | Thermally Conductive Electrically Insulating |
| PS:Certifications & Test Standards | MIL-STD 883/5011 |
| Datasheet | H67-MP.pdf |
| SDS | H67-MP SDS.pdf |
| Syringe | N/A |
| Related Brochure | EPO-TEK® Low Outgassing Adhesives.pdf |
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