A BGA package on a copper polyimide base like TAB, except TAB leads are replaced by an area array ball grid for interconnects. A stiffener is added to ensure flatness for the mass reflow assembly process.
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A BGA package on a copper polyimide base like TAB, except TAB leads are replaced by an area array ball grid for interconnects. A stiffener is added to ensure flatness for the mass reflow assembly process.
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