A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.
Bump
- Posted on January 14, 2021
A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.
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