A leadless surface-mountable package in which solder ball interconnects cover the bottom surface of the package in a checkboard fashion. BGAs are reflow soldered to PCBs using a mass reflow process.
Ball Grid Array (BGA)
- Posted on January 14, 2021
A leadless surface-mountable package in which solder ball interconnects cover the bottom surface of the package in a checkboard fashion. BGAs are reflow soldered to PCBs using a mass reflow process.
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