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EPO-TEK®
Technical Papers
& Summaries

Click on an image to download the summary of the  technical paper. The full technical papers is available in PDF format (Adobe Acrobat Reader is required for viewing):

Tech Paper #4
Epoxy Techniques for Hybrid Microwave Integrated Circuits

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Tech Paper #12
Epoxy Bleed Out in Ceramic Chip Carriers

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Tech Paper #13
Skin Problems – A Top Job Hazard Precautions and Preventative Procedures of Skin Dermatitis

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Tech Paper #20
High Density Hermetic Assembly Using Die Attachment

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Tech Paper #21
EPO-TEK® H20E Conductive Epoxy: The Effects of Mix Ratio and Pot Age on Electrical and Mechanical Performance

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Tech Paper #22
Long Term Strength Characteristics of Conductive Epoxies

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Tech Paper #24
Chip Protection in Tape Automated Bonding

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Tech Paper #38
The Suitability of Epoxy-Based Adhesives for use in Medical Devices An overview of adhesives in medical applications.

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Tech Paper #41
Wafer Protection with Screen Printable Polyimide

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Tech Paper #42
Advanced Boron Nitride Epoxy Formulations Excel In Thermal Management Applications

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Tech Paper #43
Statistical Process Control Applied to Automated Dispense of Silver Filled Epoxy for Commericial Millimeter Wave Multi Chip Module

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Tech Paper #45
Solder Joints Vs. Conductive Adhesive Bonds: A Direct Comparison for SMT Packaging Technologies

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Tech Paper #47
Study of RF Flip-Chip Assembly with Underfill Epoxy

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Tech Paper #48
Conductive Adhesives for Thermal Management; Case Study in Hybrid Microelectronics and Plastic IC Packaging

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Tech Paper #50
SMT Adhesive Dispensing

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Tech Paper #51
Epoxies for OptoElectronic Packaging: Applications and Material Properties

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Tech Paper #52
A Compact Ultrasonic Transducer Using the Active Piezoceramic Material as Electronics Carrier

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Tech Paper #53
Composite Ultrasound Arrays for Operation Above 20 MHz

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Tech Paper #54
Reliability and Degradation of Organic Light Emitting Devices

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Tech Paper #55
P-45: Assembly of an XGA 0.9” LCoS Display using Inorganic Alignment Layers for VAN LC

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Tech Paper #56
Luxeon Emitter Assembly Information Thermal Management criteria when designing new Emitters for Power Light Sources

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Tech Paper #59
Compatibility of Medical Devices and Materials with Low Temperature Hydrogen Peroxide Gas Plasma

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Tech Paper #60
Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology

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Tech Paper #61
Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment

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Tech Paper #62
Fabricating Large Arrays of Microwells with Arbitrary Dimensions and Filling Them Using Discontinuous Dewetting

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Tech Paper #63
A Three Axis Micropositioner for Ultrahigh Vacuum Use Based on the Inertial Slider Principle

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Tech Paper #64
High Frequency Properties of Passive Materials for Ultrasonic Transducers

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Tech Paper #66
Unique EPO-TEK® UV Hybrid Adhesives and their Applications

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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2020
    02-11  to  02-13 MD&M WEST 2020 1653 Anaheim Convention Center
    03-10  to  03-12 OFC 2020 4139 San Diego Convention Center
    03-24  to  03-26 Adhesives & Bonding Expo 531 Suburban Collection Showplace Novi, Michigan
    05-12  to  05-20 iMAPS 2020 TBA Boxboro Regency
    06-22  to  06-24 Sensors 2020 1219 McEnery Convention Ctr., San Jose, CA
    06-23  to  06-25 IMS 2020 2546 Los Angeles Convention Center
    07-21  to  07-23 SEMICON West 2020 734 S. Moscone Center, San Francisco
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    sweden
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2020
    02-05  to  02-07 SEMICON KOREA C830 Coex, Korea - Korea
    03-12  to  03-15 WIN Eurasia, 360 Degree Manufacturing Industry Istanbul - Turkey
    03-18  to  03-20 LASER World of PHOTONICS CHINA 2020 TBD Shanghai, China - China
    03-24  to  03-26 LOPE-C München - Germany
    04-09  to  04-12 China International Medical Equipment Fair 2020 TBD Shanghai, China - China
    05-12  to  05-14 Optatec Frankfurt - Germany
    06-28  to  06-30 Photonic China EXPO 2020 TBD Beijing, China - China
    08-26  to  08-28 Touch Taiwan 2020 TBD Taipei, Taiwan - Taiwan
    09-09  to  09-11 CIOE 2020 2B85 Shanghai, China - China
    09-14  to  09-16 MedTec 2020 TBD Shanghai, China - China
    10-05  to  10-08 Bondexpo Stuttgart - Germany
    10-28  to  10-30 SEDEX TBD Coex, Korea - Korea
    11-04  to  11-07 FIT 2020, Future Industrial Technologies Izmir - Turkey
    11-10  to  11-13 Semicon Europe München - Germany
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