EPO-TEK® Glossary Of Terms |
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A synthetic resin made from acrylic acid or a derivative thereof. Acrylics possess the property of transparency, as well as offer flame resistance.
A mixture of rosin and small amounts of organic-halide activators or organic-acid activators.
A substance that enhances the ability of a flux to remove oxides and other contaminants from surfaces being joined.
Electronic components such as semiconductors, transistors, diodes, etc., that can operate on an applied electrical signal and change its basic characteristics (e.g., switching, amplification, rectification).
A process in which the conductive, resistive, and insulating materials are successively plated to define traces, pads, and elements.
The adhesion of gases or liquid molecules to the surface of solids or liquids with which they are in contact.
A hard fragmented material used with an epoxy binder as a flooring or surfacing medium. Also coarse filler used as a core for epoxy tools.
The change in the properties of a material over time and under varying conditions of humidity, temperature, pressure, etc.
Holes specifically designed in TAB tape for registration of a TAB frame. These holes can be located virtually anywhere on the tape site, however, locations are standardized in many cases.
Curing agent for epoxy resins that is any of a class of ammonia derivatives. They are derived from Ammonia (NH3).
A mercury thermometer, which gives a variable range temperature readings, is an example of an analog instrument.
An electrical circuit that provides a continuous relationship between its input and output.
Conductive adhesives that conduct electricity in one direction only. Also referred to as "Z-axis conductive adhesives." When using this type of adhesive, high Z-axis forces are required during bonding. Components attached using this material use the pick, place, and attach process.
Antireflection coating. A thin, dielectric or metallic film applied to an optical surfa to reduce its reflectance and thereby increase its transmittance. ArmorA protective layer, usually metal, wrapped around a cable.
A mounting configuration for a TAB frame to an IC where the inner leads are connected to bumps in an array pattern on the surface of the IC instead of on the perimeter, which is the case for typical TAB components.
The exposure of product to cyclic laboratory conditions involving changes in temperature, relative humidity, and ultra violet radiant energy, with or without direct water spray, in an attempt to produce changes in the material similar to those observed after continuous outdoor exposure. Note-The laboratory exposure conditions are usually intensified beyond those encountered in actual outdoor exposure in an attempt to achieve an accelerated effect.
The decrease in signal strength along a fiber optic waveguide caused by absorption and scattering. Attenuation is usually expressed in dB/km.
Equipment that automatically analyzes functional or static parameters to evaluate performance.

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