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EPO-TEK® Glossary Of Terms

 
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AC

Alternating current.

Acrylic

A synthetic resin made from acrylic acid or a derivative thereof. Acrylics possess the property of transparency, as well as offer flame resistance.

Activated Rosin Flux
A mixture of rosin and small amounts of organic-halide activators or organic-acid activators.
Activators
A substance that enhances the ability of a flux to remove oxides and other contaminants from surfaces being joined.
Active Components
Electronic components such as semiconductors, transistors, diodes, etc., that can operate on an applied electrical signal and change its basic characteristics (e.g., switching, amplification, rectification).
AD or ADC Analog-to-digital converter
A device used to convert analog signals to digital signal.
Additive Plating
A process in which the conductive, resistive, and insulating materials are successively plated to define traces, pads, and elements.
Adhesion
The state in which two surfaces are held together by means of interfacial forces.
Adhesive
A substance capable of holding materials together by surface attachment.
Adsorption
The adhesion of gases or liquid molecules to the surface of solids or liquids with which they are in contact.
Aggregate
A hard fragmented material used with an epoxy binder as a flooring or surfacing medium. Also coarse filler used as a core for epoxy tools.
Aging
The change in the properties of a material over time and under varying conditions of humidity, temperature, pressure, etc.
Alignment Holes (or Tooling Holes)
Holes specifically designed in TAB tape for registration of a TAB frame. These holes can be located virtually anywhere on the tape site, however, locations are standardized in many cases.
Alloy
A metal formed by combining two or more other metals.
Amine
Curing agent for epoxy resins that is any of a class of ammonia derivatives. They are derived from Ammonia (NH3).
Analog A continuously variable signal
A mercury thermometer, which gives a variable range temperature readings, is an example of an analog instrument.
Analog Circuit
An electrical circuit that provides a continuous relationship between its input and output.
Angular Misalignment
Loss at a connector due to fiber end face angles being misaligned.
Anisotropic Conductive Adhesive ( ACA )
Conductive adhesives that conduct electricity in one direction only. Also referred to as "Z-axis conductive adhesives." When using this type of adhesive, high Z-axis forces are required during bonding. Components attached using this material use the pick, place, and attach process.
ANSI
American National Standards Institute.
Aqueous Cleaning
A cleaning technique that uses water as the primary cleaning fluid.
AR Coating
Antireflection coating. A thin, dielectric or metallic film applied to an optical surfa to reduce its reflectance and thereby increase its transmittance. ArmorA protective layer, usually metal, wrapped around a cable.
Area Array TAB
A mounting configuration for a TAB frame to an IC where the inner leads are connected to bumps in an array pattern on the surface of the IC instead of on the perimeter, which is the case for typical TAB components.
Array
A group of elements or circuits arranged in rows and columns on a substrate.
Artificial Weathering
The exposure of product to cyclic laboratory conditions involving changes in temperature, relative humidity, and ultra violet radiant energy, with or without direct water spray, in an attempt to produce changes in the material similar to those observed after continuous outdoor exposure. Note-The laboratory exposure conditions are usually intensified beyond those encountered in actual outdoor exposure in an attempt to achieve an accelerated effect.
ASCII
American standard code for information interchange. A means of encoding information.
ASIC
Application-specific integrated circuit. A custom-designed integrated circuit.
Assembly
A group of components physically joined to a PCB or ceramic board.
ASTM
American Society for Testing and Materials.
Attenuation
The decrease in signal strength along a fiber optic waveguide caused by absorption and scattering. Attenuation is usually expressed in dB/km.
Automated Test Equipment
Equipment that automatically analyzes functional or static parameters to evaluate performance.
Azeotrope
A blend of two or more polar and nonpolar solvents that act as a single solvent and can be used to remove both polar and nonpolar contaminants.
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Spotlight

Latest Advancements in Adhesives for Thermal Management Webinar

Epoxy Technology has investigated the mechanism of thermal conductivity in electrically conductive adhesives. Utilizing laser flash testing and SEM cross sections, we determined how silver flake distribution effects thermal conductivity. Cure, interface, and processing play a significant role in thermal management. This webinar reviews a new laser flash sample preparation methodology that provides more accurate measurement of “in-design” thermal resistance. To view this webinar click here.

 

Featured Products
EPO-TEK®  H20E-D
Applications:  Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Conductivity:  Electrical,
Thermal,
Cure: Oven,
Snap,
Potlife:  days
Viscosity:  low
Thixo:  high
Market:  Electronics Assembly,
Hybrid,
Semiconductor,
Tg:  med
MSDS:  
Data Sheet:  
Notes:  
read more
EPO-TEK®  H20S-D
Applications:  Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor,
Solar,
Solder Replacement,
Wafer Level,
Conductivity:  Electrical,
Thermal,
Cure: Oven,
Snap,
Potlife:  days
Viscosity:  low
Thixo:  high
Market:  Electronics Assembly,
Hybrid,
Semiconductor,
Solar,
Tg:  med
MSDS:  
Data Sheet:  
Notes:  
read more
EPO-TEK®  H20E-PFC-D
Applications:  Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Conductivity:  Electrical,
Thermal,
Cure: Oven,
Potlife:  days
Viscosity:  med
Thixo:  high
Market:  Electronics Assembly,
Hybrid,
Semiconductor,
Tg:  med
MSDS:  
Data Sheet:  
Notes:  
read more
EPO-TEK®  EK1000-1-D
Applications:  Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Conductivity:  Electrical,
Thermal,
Cure: Oven,
Potlife:  days
Viscosity:  low
Thixo:  med
Market:  Electronics Assembly,
General,
Hybrid,
Semiconductor,
Solar,
Tg:  low
MSDS:  
Data Sheet:  
Notes:  
read more


Press Releases

Epoxy Technology, Inc. announces a comprehensive (MED) line of Biocompatible Adhesives, tested to the most stringent ISO 10993 Testing Method

(Billerica, MA) – January 24, 2019- - Epoxy Technology Inc, a leading manufacturer of high performance specialty epoxy, UV & Hybrid adhesives for over 52 years, is pleased to announce the completion of ISO 10993 testing of its previously Class VI adhesives, as well as the significant addition of 12 new Medical device grade adhesives, to extend its MED line of biocompatible products to 23.

Read more...

Arsenal Capital Partners Acquires Epoxy Technology; Second Acquisition of Meridian Adhesives Group

(New York) – June 6, 2018- Arsenal Capital Partners (“Arsenal”), a leading private equity firm that invests in middlemarket specialty industrials and healthcare business services companies, announced today the acquisition of Epoxy Technology, Inc. (“Epoxy Tech”), a leading manufacturer of high-performance specialty epoxy, ultraviolet, and hybrid adhesives.

Read more...

Epoxy Technology Inc. Announces a New U.S. Authorized Representative – The IPS Group

(Billerica, MA) – July 6, 2017- Epoxy Technology Inc., a leading manufacturer of high performance specialty epoxy, UV & Hybrid adhesives for over 50 years, introduces a new, authorized sales representative company: The IPS Group, covering Arkansas, Louisiana, Oklahoma and Texas. 

Read more...

Epoxy Technology Inc. Announces New Literature for Jewelry and Watch Markets

(Billerica, MA) – June 28, 2017- Epoxy Technology Inc., a leading manufacturer of high performance specialty epoxy, UV & Hybrid adhesives for over 50 years, introduces new literature to showcase the features and benefits of using EPO-TEK® adhesives in Jewelry and Watch applications.

 

Read more...

Epoxy Technology Inc. Announces 50 Years of Adhesive Excellence

(Billerica, MA) – February 17, 2016- Epoxy Technology Inc, a leading manufacturer of high performance specialty epoxy, UV & Hybrid adhesives is celebrating 50 years of adhesive innovation and excellence.  Since 1966, EPO-TEK® products have been synonymous with high performance and reliability.  EPO-TEK adhesives are routinely specified by design engineers world-wide for critical assembly project in a multitude of industries.

Read more...


EPO-TEK Blog Posts
Let's Talk Epoxy With EPO-TEK®

  • Are You Properly Curing UV Adhesives?

    By Mark BusaSales & MarketingEpoxy Technology, Inc.UV curing adhesives offer a convenient way to quickly cure an adhesive in specific applications.  In order to receive the full benefits of UV curing products, it is very important to cure these materials properly.  Below are some important questions to take into consideration...

  • Effects of Relative Humidity and Temperature on Room Temperature Curing ECAs

    By Mavyn HolmanR&D ManagerEpoxy Technology, Inc.Fall has arrived in New England and winter will be here before we know it.  Unfortunately, that means cold temperatures, snow and more importantly for our adhesives - low humidity.  Did you know that maintaining proper humidity levels in your manufacturing environment can play...

  • Insights on How to Work Best with Epoxies from EPO-TEK® Quality Control Department

    By Dawna Bellerose, Quality Control SupervisorUpon receipt of your specialty EPO-TEK adhesive, it’s important to perform an incoming inspection of the product.  This ensures your product was received in good condition.  For optimal results, here are some important insights for receiving and using our products:1.     Make sure the product...

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