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EPO-TEK® Glossary Of Terms

 

UL
Underwriter's Laboratory
Ultrasonic Cleaning
The use of ultrasonic energy along with a chemical solvent to clean a component or a PCB assembly immersed in solvent. Mechanical oscillation is introduced by the ultrasonic energy to facilitate cleaning.
Ultraviolet
The invisible region of the spectrum just beyond the violet end of the visible region. Wavelengths range from 1 to 400 nm.
Underfill
In flip chip applications, the material injected under the die after testing to ensure reliability. This material is particularly important for flip chips mounted on substrates with different CTEs than silicon, such as FR-4 and some ceramics.
Unidirectional
Operating in one direction only
UV
Ultraviolet.
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    International Tradeshows

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    2020
    08-26  to  08-28 Touch Taiwan 2020 TBD Taipei, Taiwan - Taiwan
    09-09  to  09-11 CIOE 2020 4B031/4B Shenzhen - China
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    10-05  to  10-08 Bondexpo Stuttgart - Germany
    10-28  to  10-30 SEDEX TBD Coex, Korea - Korea
    11-04  to  11-07 FIT 2020, Future Industrial Technologies Izmir - Turkey
    11-10  to  11-13 Semicon Europe München - Germany
    11-11  to  11-13 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) A317 Wuhan - China
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