EPO-TEK® Glossary Of Terms


T Tera.
One trillion.
TAB Component
An IC mounted on a TAB site.
Tape Automated Bonding (TAB)
The process where silicon chips are joined to patterned metal traces (leads) on polymer tape to form inner leads bonds and subsequently the leads are attached to the next level of the assembly, typically a substrate or board, to form outer lead bonds. TAB is the technique of interconnecting silicon with beam bonding as opposed to wire bonding.
Tape Ball Grid Array (TBGA)
A BGA package on a copper polyimide base like TAB, except TAB leads are replaced by an area array ball grid for interconnects. A stiffener is added to ensure flatness for the mass reflow assembly process.
Tape Bonding
Utilization of a metal or plastic tape material as a support to a carrier of a component in a gang bonding process.
Abbreviation for thermoelectric cooler.
Temperature, Curing
The temperature to which an adhesive or an assembly is subjected to cure the adhesive. Note-The temperature attained by the adhesive in the process of setting it may differ from the temperature of the atmosphere surrounding the assembly.
Tensile Strength
The pulling force necessary to break a given specimen divided by the cross sectional area. Units given in lbs./in/2 (P.S.I.). It measures the resistance of a material to stretching without rupture. Normally is not used with reference to elastic materials which recover after elongation.
A metallic device used for making electrical connections.
Test Pattern
A pattern used for inspecting or testing purposes.
Thermal Conductivity
A measure of how rapidly heat is conducted through a material.
Thermal Cycling
A method used to induce stresses on electrical components by means of sequential heating and cooling in an oven. It is used in accelerated reliability testing.
Thermal Noise
Noise resulting from thermally induced random fluctuation in current in the receiver's load resistance.
Thermal Profile
A time versus temperature graph that displays the temperatures an assembly is subjected to over time in an oven during processes such as reflow soldering or the curing of adhesives, encapsulants, and conformal coatings.
Thermal Shock Resistance
The ability of a cured system to resist cracking or crazing under conditions of rapid and continuous thermal change. The 1/4 inch Olyphant Washer test is cycled over a temperature range of -55¡C to +125¡C, this temperature is normally used as the test condition unless otherwise stated.
Thermocompression Bonding
The joining of two materials without an intermediate material by the application of pressure and heat in the absence of electrical current.
Polymer materials that can be repeatedly melted without significant change in their properties.
Describes the property of an epoxy, to set or become rigid and non-meltable when heated with or without pressure.
Thermosetting Plastic
Polymer materials that cure (irreversably polymerize) at specific temperature and time conditions.
Thixotropic Ratio
An indication of thixotropy as a ratio of viscosities at two different shear rates.
False body. The property of a paste or fluid to thicken or set up to a paste or semi-gel when allowed to stand. Agitation breaks it down but further standing will again permit a viscosity rise. Time, Curing
Torsional Strength
The torque required to separate adhesive bonded (and cured) materials and/or components.
A device that performs, within one chassis, both telecommunicafion transmitting and receiving functions.
An active semiconductor device capable of providing power amplification. Transistors have three or more terminals.
A device that includes a source and driving electronics. It functions as an electricalto-optical converter.
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