EPO-TEK® Glossary Of Terms


p Pico
. One trillionth.
Packaging Density
The quantity of components, interconnections, and mechanical devices per unit volume.
Packaging Level
The various members that comprise the packaging hierarchy, such as chip, chip carrier, PCB, system, etc.
A portion of the conductive pattern that is typically used for the connection, and/or attachment of components.
PBGA (Plastic Ball Grid Array)
Generic name for a BGA component constructed on organic substrate material, such as FR-4, overmolded with plastic.
Printed circuit board.
Peel Strength
A true test of the adhesion between the lead and the bonding pad after it has been soldered. This parameter is determined by peeling the component lead off the bonding pad using special fixturing on a pull tester.
A two-electrode, radiation-sensitive junction formed in a semiconductor material in which the reverse current varies with illumination. ItÕs a semiconductor device that converts light to electrical current. Photodiodes are used for the detection of optical power and for the conversion of optical power to electrical power.
The technology involving light and photons at all wavelengths between the far-infrared and the ultra-violet. Also called "Optoelectronics".
Providing an electric current under the influence of light or similar radiation.
The assembly process in which components are selected and placed onto specific locations of the PCB.
The fine solid particle, usually inorganic, used in the preparation of colored products, and substantially insoluble in the vehicle. In contrast, a dye is soluble.
Small regular or irregular crater in a surface, usually with its width approximately of the same order of magnitude as its depth.
The center-to-center spacing between pads, rows of bumps, pins, etc.
Plasma Cleaning
A cleaning process that uses electrically excited gas molecules to remove surface contamination. Most commonly found in applications where extreme cleanliness is required, such as bonding pad preparation on the chip and substrate for wire bonding.
Plastic Deformation
With respect to materials science, the deformation of a material resulting from it being stressed beyond its ability to return to its original shape.
Plastic Fiber
An optical fiber having a plastic core and plastic cladding.
Plating Inconsistency
Variance in overall lead plating thickness and cross-sectional characteristics, which can cause lead form variation during the lead forming process.
Polar Solvent
A solvent with the ability to dissolve polar compounds such as inorganic salts. However, polar solvents cannot dissolve nonpolar compounds such as resins and hydrocarbons.
The direction of the electric field in the lightwave.
Polarization Maintaining Fiber
Fiber that maintains the polarization of light that enters it.
Polarization Mode Dispersion
(PMD) Polarization mode dispersion is an inherent property of all optical media. It is caused by the difference in the propagation velocities of light in the orthogonal principal polarization states of the transmission medium. The net effect is that if an optical pulse contains both polarization components, then the different polarization components will travel at different speeds and arrive at different times, smearing the received optical signal.
Thermosetting ring chain polymers characterized by -NH group. They are being increasingly used as dielectrics in high performance circuits.
To chemically unite two or more polymers or monomers of the same kind to form a molecule with higher molecular weight.
Pot Life
The length of working time of a two component reactive system from the time of the addition of the curing agent in a specific mass (i.e. 100 grams). It is expressed in minutes.
Similar to encapsulating, except that steps are taken to insure complete penetration of all the voids in the object before the resin polymerizes.
A preliminary phase of a process during which the product is heated at a predetermined rate from the ambient temperature to a desired elevated temperature.
Increasing the temperature of a material above the ambient temperature to reduce the thermal shock and influence the dwell time during subsequent elevated temperature processing.
Partially-cured fiber-reinforced resin fabric. Also referred to as the B-stage in the manufacturing of PCB.
A graphical representation of the time versus temperature of a continuous furnace or oven cycle.
(Picosecond ) One trillionth of a second.
A fluid that displays a decrease in viscosity with an increase in the shear rate.
Pull Strength
A measure of the quality of a solder joint formed between a component lead and a bonding pad on a substrate. This parameter is typically determined by placing a hook under the shoulder of a lead and pulling up.
( Picowatt ) One trillionth of a Watt.
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