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EPO-TEK® Glossary Of Terms

 

B-Stage
An intermediate stage in the reaction of certain thermosetting resins in which the material softens when heated and swells when in contact with certain liquids, but may not entirely fuse or dissolve. The resin in an uncured thermosetting system, is usually in this stage.
Backscattering
The return of a portion of scattered light to the input end of a fiber; the scattering of light in the direction opposite to its original propagation.
Baking Temperature
A temperature above 150°F.(65.6°C). Refers to curing materials at these elevated temperatures.
Ball Grid Array (BGA)
A leadless surface-mountable package in which solder ball interconnects cover the bottom surface of the package in a checkboard fashion. BGAs are reflow soldered to PCBs using a mass reflow process.
Bandwidth
The range of frequencies over which a particular instrument is designed to function within specified limits.
Bare Board
An unpopulated PCB.
Bend Radius
The smallest radius an optical fiber or fiber cable can bend before increased attenuation or breakage occurs.
Bending
Loss Attenuation caused by high-order modes radiating from the outside of a fiber optic waveguide which occur when the fiber is bent around a small radius. See also macrobending, microbending.
Birefringent
Having a refractive index that differs for light of different polarizations.
Bit
The smallest unit of information upon which digital communications are based; also an electrical or optical pulse that carries this information.
Board
An organic printed circuit card or board on which smaller components, cards, or modules can be mounted.
Bond
The union of materials by adhesives.
Bond Strength
The unit load applied in tension, compression, flexure, peel, impact, cleavage, or shear, required to break an adhesive assembly with failure occurring in or near the plane of the bond. Note-The term adherence is frequently used in place of bond strength.
Bonding
The joining of two materials. For instance, the attachment of a component to a substrate.
Bonding Pads
Copper traces, or pads, on a substrate to which leads are bonded. Dimensions and thermal path from the bonding pads must be properly designed to achieve uniform solder reflow.
Brookfield Viscosimeter
An instrument for measuring the viscosity of formulated adhesives under standard conditions of temperature.
Bubble
Internal void or a trapped globule of air or other gas.
Bump
A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.
Burn-In
The process in which a device is electrically stressed by subjecting it to an elevated temperature and voltage for an adequate period of time to cause the failure of a marginal device.
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  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
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    International Tradeshows

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    Date Event Booth Location
    2018
    01-31  to  02-02 SEMICON Korea C762 Seoul - Korea
    03-14  to  03-15 LOPEC B0/403 Munich - Germany
    03-14  to  03-16 Electronica China 2018 E1 1012 Shanghai, China - China
    03-15  to  03-15 Power Electronics & Battery B2 Telford, West Midlands UK - UK
    03-15  to  03-18 West China Aerospace & Military Industry Exhibition C18-3 Xi'an City, Shaaxi Province, PRC - China
    03-22  to  03-22 BAM St. Hallle, Switzerland - Germany
    03-22  to  03-24 MECSPE Hall 6 Parma, Italy -
    04-25  to  04-26 CAM Halle - Germany
    05-15  to  05-17 OPTATEC Hall 3.0 Frankfurt - Germany
    05-15  to  05-18 Joining Technology A07:31 Jönköping, Sweden -
    06-21  to  06-24 Medicare Taiwan 2018 TBA Taipei City, Taiwan - Taiwan
    07-4  to  07-5 UK Semiconductors TBA Sheffield - UK
    08-29  to  08-31 Touch & Display Taiwan 2018 TBA Taipei City, Taiwan - Taiwan
    09-05  to  09-08 China International Optoelectronic Expo (CIOE) TBA Shenzhen - China
    09-25  to  09-28 Micronora TBA Besançon, France - France
    10-08  to  10-11 Bondexpo Stuttgart - Germany
    10-23  to  10-26 GLASSTEC Düsseldorf - Germany
    10-30  to  11-01 Advanced Engineering TBA NEC Birmingham - UK
    11-13  to  11-16 SEMICON Europa A4/161 München - Germany
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