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EPO-TEK® Glossary Of Terms

 

B-Stage
An intermediate stage in the reaction of certain thermosetting resins in which the material softens when heated and swells when in contact with certain liquids, but may not entirely fuse or dissolve. The resin in an uncured thermosetting system, is usually in this stage.
Backscattering
The return of a portion of scattered light to the input end of a fiber; the scattering of light in the direction opposite to its original propagation.
Baking Temperature
A temperature above 150°F.(65.6°C). Refers to curing materials at these elevated temperatures.
Ball Grid Array (BGA)
A leadless surface-mountable package in which solder ball interconnects cover the bottom surface of the package in a checkboard fashion. BGAs are reflow soldered to PCBs using a mass reflow process.
Bandwidth
The range of frequencies over which a particular instrument is designed to function within specified limits.
Bare Board
An unpopulated PCB.
Bend Radius
The smallest radius an optical fiber or fiber cable can bend before increased attenuation or breakage occurs.
Bending
Loss Attenuation caused by high-order modes radiating from the outside of a fiber optic waveguide which occur when the fiber is bent around a small radius. See also macrobending, microbending.
Birefringent
Having a refractive index that differs for light of different polarizations.
Bit
The smallest unit of information upon which digital communications are based; also an electrical or optical pulse that carries this information.
Board
An organic printed circuit card or board on which smaller components, cards, or modules can be mounted.
Bond
The union of materials by adhesives.
Bond Strength
The unit load applied in tension, compression, flexure, peel, impact, cleavage, or shear, required to break an adhesive assembly with failure occurring in or near the plane of the bond. Note-The term adherence is frequently used in place of bond strength.
Bonding
The joining of two materials. For instance, the attachment of a component to a substrate.
Bonding Pads
Copper traces, or pads, on a substrate to which leads are bonded. Dimensions and thermal path from the bonding pads must be properly designed to achieve uniform solder reflow.
Brookfield Viscosimeter
An instrument for measuring the viscosity of formulated adhesives under standard conditions of temperature.
Bubble
Internal void or a trapped globule of air or other gas.
Bump
A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.
Burn-In
The process in which a device is electrically stressed by subjecting it to an elevated temperature and voltage for an adequate period of time to cause the failure of a marginal device.
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  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2020
    02-11  to  02-13 MD&M WEST 2020 1653 Anaheim Convention Center
    03-10  to  03-12 OFC 2020 3438 San Diego Convention Center
    03-24  to  03-26 Adhesives & Bonding Expo 531 Suburban Collection Showplace Novi, Michigan
    05-12  to  05-20 iMAPS 2020 TBA Boxboro Regency
    06-22  to  06-24 Sensors 2020 1219 McEnery Convention Ctr., San Jose, CA
    06-23  to  06-25 IMS 2020 2546 Los Angeles Convention Center
    07-21  to  07-23 SEMICON West 2020 734 S. Moscone Center, San Francisco
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    Date Event Booth Location
    2020
    02-05  to  02-07 SEMICON KOREA C830 Coex, Korea - Korea
    03-12  to  03-15 WIN Eurasia, 360 Degree Manufacturing Industry Istanbul - Turkey
    03-18  to  03-20 LASER World of PHOTONICS CHINA 2020 TBD Shanghai, China - China
    03-24  to  03-26 LOPE-C München - Germany
    04-09  to  04-12 China International Medical Equipment Fair 2020 TBD Shanghai, China - China
    05-05  to  05-07 SMT Hall 5 B Nuremberg - Germany
    05-12  to  05-14 Optatec Frankfurt - Germany
    06-28  to  06-30 Photonic China EXPO 2020 TBD Beijing, China - China
    08-26  to  08-28 Touch Taiwan 2020 TBD Taipei, Taiwan - Taiwan
    09-09  to  09-11 CIOE 2020 2B85 Shanghai, China - China
    09-14  to  09-16 MedTec 2020 TBD Shanghai, China - China
    10-05  to  10-08 Bondexpo Stuttgart - Germany
    10-28  to  10-30 SEDEX TBD Coex, Korea - Korea
    11-04  to  11-07 FIT 2020, Future Industrial Technologies Izmir - Turkey
    11-10  to  11-13 Semicon Europe München - Germany
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