EPO-TEK® Glossary Of Terms



Alternating current.


A synthetic resin made from acrylic acid or a derivative thereof. Acrylics possess the property of transparency, as well as offer flame resistance.

Activated Rosin Flux
A mixture of rosin and small amounts of organic-halide activators or organic-acid activators.
A substance that enhances the ability of a flux to remove oxides and other contaminants from surfaces being joined.
Active Components
Electronic components such as semiconductors, transistors, diodes, etc., that can operate on an applied electrical signal and change its basic characteristics (e.g., switching, amplification, rectification).
AD or ADC Analog-to-digital converter
A device used to convert analog signals to digital signal.
Additive Plating
A process in which the conductive, resistive, and insulating materials are successively plated to define traces, pads, and elements.
The state in which two surfaces are held together by means of interfacial forces.
A substance capable of holding materials together by surface attachment.
The adhesion of gases or liquid molecules to the surface of solids or liquids with which they are in contact.
A hard fragmented material used with an epoxy binder as a flooring or surfacing medium. Also coarse filler used as a core for epoxy tools.
The change in the properties of a material over time and under varying conditions of humidity, temperature, pressure, etc.
Alignment Holes (or Tooling Holes)
Holes specifically designed in TAB tape for registration of a TAB frame. These holes can be located virtually anywhere on the tape site, however, locations are standardized in many cases.
A metal formed by combining two or more other metals.
Curing agent for epoxy resins that is any of a class of ammonia derivatives. They are derived from Ammonia (NH3).
Analog A continuously variable signal
A mercury thermometer, which gives a variable range temperature readings, is an example of an analog instrument.
Analog Circuit
An electrical circuit that provides a continuous relationship between its input and output.
Angular Misalignment
Loss at a connector due to fiber end face angles being misaligned.
Anisotropic Conductive Adhesive ( ACA )
Conductive adhesives that conduct electricity in one direction only. Also referred to as "Z-axis conductive adhesives." When using this type of adhesive, high Z-axis forces are required during bonding. Components attached using this material use the pick, place, and attach process.
American National Standards Institute.
Aqueous Cleaning
A cleaning technique that uses water as the primary cleaning fluid.
AR Coating
Antireflection coating. A thin, dielectric or metallic film applied to an optical surfa to reduce its reflectance and thereby increase its transmittance. ArmorA protective layer, usually metal, wrapped around a cable.
Area Array TAB
A mounting configuration for a TAB frame to an IC where the inner leads are connected to bumps in an array pattern on the surface of the IC instead of on the perimeter, which is the case for typical TAB components.
A group of elements or circuits arranged in rows and columns on a substrate.
Artificial Weathering
The exposure of product to cyclic laboratory conditions involving changes in temperature, relative humidity, and ultra violet radiant energy, with or without direct water spray, in an attempt to produce changes in the material similar to those observed after continuous outdoor exposure. Note-The laboratory exposure conditions are usually intensified beyond those encountered in actual outdoor exposure in an attempt to achieve an accelerated effect.
American standard code for information interchange. A means of encoding information.
Application-specific integrated circuit. A custom-designed integrated circuit.
A group of components physically joined to a PCB or ceramic board.
American Society for Testing and Materials.
The decrease in signal strength along a fiber optic waveguide caused by absorption and scattering. Attenuation is usually expressed in dB/km.
Automated Test Equipment
Equipment that automatically analyzes functional or static parameters to evaluate performance.
A blend of two or more polar and nonpolar solvents that act as a single solvent and can be used to remove both polar and nonpolar contaminants.
For additional product selection assistance,
tell us about your application and its specific design criteria and a technical service representative will contact you directly.
Featured Products
Press Releases
EPO-TEK Blog Posts
Video Tutorials
  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    02-11  to  02-13 MD&M WEST 2020 1653 Anaheim Convention Center
    03-10  to  03-12 OFC 2020 3438 San Diego Convention Center
    03-24  to  03-26 Adhesives & Bonding Expo 531 Suburban Collection Showplace Novi, Michigan
    05-12  to  05-20 iMAPS 2020 TBA Boxboro Regency
    06-22  to  06-24 Sensors 2020 1219 McEnery Convention Ctr., San Jose, CA
    06-23  to  06-25 IMS 2020 2546 Los Angeles Convention Center
    07-21  to  07-23 SEMICON West 2020 734 S. Moscone Center, San Francisco
  3. GLOBAL Tradeshows

    International Tradeshows

    Date Event Booth Location
    02-05  to  02-07 SEMICON KOREA C830 Coex, Korea - Korea
    03-12  to  03-15 WIN Eurasia, 360 Degree Manufacturing Industry Istanbul - Turkey
    03-24  to  03-26 LOPE-C München - Germany
    05-05  to  05-07 SMT Hall 5 B Nuremberg - Germany
    05-12  to  05-14 Optatec Frankfurt - Germany
    06-03  to  06-06 China International Medical Equipment Fair 2020 5.2N62 Shanghai - China
    06-18  to  06-21 2020 China Xi'an Int'l Sensor & Application Technology Exhibition A1C06-5 Xi'an - China
    06-28  to  06-30 Photonic China EXPO 2020 TBD Beijing - China
    07-03  to  07-05 Productronica China TBA Shanghai - China
    07-15  to  07-17 China Electronics Fair West Show 4B145 Chengdu, China - China
    08-26  to  08-28 Touch Taiwan 2020 TBD Taipei, Taiwan - Taiwan
    09-09  to  09-11 CIOE 2020 4B031/4B Shenzhen - China
    09-14  to  09-16 MedTec 2020 TBD Shanghai - China
    10-05  to  10-08 Bondexpo Stuttgart - Germany
    10-28  to  10-30 SEDEX TBD Coex, Korea - Korea
    11-04  to  11-07 FIT 2020, Future Industrial Technologies Izmir - Turkey
    11-10  to  11-13 Semicon Europe München - Germany
    11-11  to  11-13 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) A317 Wuhan - China

This website stores cookies on your computer. These cookies are used to improve your website and provide more personalized services to you, both on this website and through other media. To find out more about the cookies we use, see our Privacy Policy.