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Complete List of Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
301 Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
low
301-1 Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
low
301-2 Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Solar,
Underfill
None
Oven,
Room Temperature
med
med
N/A
low
301-2FL Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
long
low
N/A
low
301-2FL-CX Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
med
low
N/A
low
301-2FL-T Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
med
low
med
low
301-2G Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
long
high
N/A
low
302 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
None
Room Temperature
quick
low
N/A
med
302-3M Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
low
302-3M Black Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
med
302-3M-R Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor ,
Underfill
None
Oven,
Room Temperature
short
med
N/A
low
305 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310M Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310M Black Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
med
310M-1 Biocompatible,
Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
med
low
N/A
low
310M-2 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310T-M Circuit / Electronic Assembly,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Room Temperature
short
low
med
low
314 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Underfill
None
Oven
days
med
N/A
low
320 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
med
high
low
320-3 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven
days
med
med
med
320LV Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
med
N/A
low
320NC Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
None
Room Temperature
short
low
N/A
low
320NC-2 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
None
Oven,
Room Temperature
short
low
med
low
323LP Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
323LP-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
Compare Products
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    USA Tradeshows

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  3. GLOBAL Tradeshows

    International Tradeshows

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    Date Event Booth Location
    2019
    08-26  to  08-28 Int’l Phonics Convergence Trade Fair D Hall, Seoul, Korea - Korea
    08-28  to  08-30 Touch Taiwan 2019 TBA Taipei City, Taiwan - Taiwan
    09-04  to  09-07 China International Optoelectronic Expo (CIOE) Hall 2, Shenzhen - China
    09-04  to  09-07 The 21st China International Optoelectronic Exposition B60 Shenzhen - China
    09-25  to  09-27 Medtec China X107 Shanghai - China
    10-07  to  10-10 Bondexpo TBA Stuttgart - Germany
    11-12  to  11-15 Productronica TBA Munich - Germany
    11-13  to  11-15 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Hall B2, Wuhan, China - China
    11-27  to  11-28 Photonics Convergence Industry Road Show 2019 TBA Gwangju Metropolitan City - Korea
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