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Complete List of Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
GD2191 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
days
med
med
med
GE116 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Semiconductor
None
Oven
days
med
med
high
GE120 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Solder Replacement
None
Oven
days
med
med
high
GL2154 Circuit / Electronic Assembly,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Potting
None
Oven,
Room Temperature
quick
med
N/A
med
H20E Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20E-175 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
med
H20E-8 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
high
H20E-D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
high
low
H20E-FC Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
long
high
med
med
H20E-HC Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor
Electrical,
Thermal
Oven
days
med
med
med
H20E-LC Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20E-LV Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
low
H20E-MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
high
med
H20E-PFC Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
high
med
H20E-PFC-D Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
high
med
H20E-SLR Solar
Electrical,
Thermal
Oven,
Snap
long
med
med
med
H20E-SLR-HV Solar
Electrical,
Thermal
Oven,
Snap
long
med
med
med
H20E-SLR-HVMX Solar
Electrical,
Thermal
Oven,
Snap
long
med
med
med
H20E-SLR-MX Solar
Electrical,
Thermal
Oven,
Snap
long
med
high
med
H20F Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
low
med
med
H20S Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20S-D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
high
low
H21D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
long
high
med
med
H22 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics
Electrical,
Thermal
Oven
long
med
med
med
H24 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
long
high
low
med
Compare Products
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