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Hybrid Microelectronics Assembly Applications

 
Compare Products
Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
354-T Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven
days
high
med
med
360 Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Snap
med
med
N/A
low
360ST Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Snap
med
med
med
low
360T Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Snap
med
med
high
med
375 Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Snap
med
high
N/A
med
375-T Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Snap
med
high
med
med
377H Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor
Electrical
Oven
days
high
N/A
low
383ND Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
Semiconductor
None
Oven
med
high
N/A
med
383ND-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
383ND-LH Ultra Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor,
Wafer Level
None
Oven
long
high
N/A
med
430 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
med
high
N/A
high
431 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor
Electrical,
Thermal
Oven
med
high
N/A
high
509FM-1 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Room Temperature
short
low
N/A
low
920 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
920-FL Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
921 Circuit / Electronic Assembly,
Hybrids Microelectronics,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
921-FL Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
930 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials
Thermal
Oven
med
med
N/A
high
930-1 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
long
med
med
high
930-4 Circuit / Electronic Assembly,
Fiber Optic,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor,
Solar
Thermal
Oven
long
med
med
med
B9021 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials
None
Oven
days
med
med
med
B9021-15 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor,
Wafer Level
Thermal
Oven
days
high
high
high
B9101-2 Unfilled Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Underfill,
Wafer Level
None
Oven
days
med
N/A
low
B9126-7 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials
Thermal
Oven,
Snap
days
med
med
high
B9126-8 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials
Electrical,
Thermal
Oven,
Snap
days
med
med
med
Compare Products
FAQ
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