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Hybrid Microelectronics Assembly Applications

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
H70E-4 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
high
H70E-TI Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-TI-LH Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
med
med
H70S Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
low
H72 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
low
med
H73 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
med
high
N/A
high
H74 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
med
high
H74F Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
med
med
high
H74G Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Semiconductor,
Wafer Level
Thermal
Oven
quick
high
low
high
H75 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
N/A
high
H77 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
low
med
H77 Black Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
med
med
H77S Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Underfill
Thermal
Oven
med
med
low
med
H77T Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials
Thermal
Oven
med
med
med
med
H81 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
H81A Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
M10-D Circuit / Electronic Assembly,
Hybrids Microelectronics,
LCDs,
Opto-Packaging,
Semiconductor
None
Oven
days
med
high
med
N20E Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Electrical,
Thermal
Oven,
Snap
days
med
med
med
OD1001-67 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor,
Underfill
None
Oven
days
low
med
med
OE100T Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor
None
Oven
med
med
high
med
OE132-43 Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Semiconductor
None
Oven
days
high
N/A
low
OE188-3 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
quick
high
N/A
high
OG116-31 Circuit / Electronic Assembly,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor
None
UV Light
N/A
high
low
high
OG198-56 Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Semiconductor
None
UV Light
N/A
high
high
low
OH105-2 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Semiconductor,
Wafer Level
None
Oven,
Room Temperature
quick
med
high
med
Compare Products
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