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Hybrid Microelectronics Assembly Applications

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
H31LV Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
low
low
H35-175MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
med
med
H35-175MPLV Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
med
med
H35-175MPT Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
high
high
H37-MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
med
med
med
H37-MPT Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
med
high
high
H37MP-2 Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
med
high
H44 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
N/A
high
N/A
high
H54 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
None
Oven
med
med
med
med
H55 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
med
high
N/A
high
H61 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
high
low
high
H61-110 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Underfill,
Wafer Level
None
Oven
days
high
N/A
low
H61LV Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
high
low
med
H61ND Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
high
med
med
H62 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
high
med
med
H63 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
high
low
med
H65-175MP Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
high
med
high
H67-MP Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
med
N/A
high
H67MP-GB Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
med
N/A
high
H67MP-T Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven
days
high
N/A
high
H70E Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Wafer Level
Thermal
Oven,
Snap
days
med
low
med
H70E-1 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
high
med
H70E-175 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-2 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-2 Unpigmented Circuit / Electronic Assembly,
Glob Top,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor,
Wafer Level
Thermal
Oven,
Snap
days
med
low
med
Compare Products
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