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Complete List of Products

 
Compare Products
Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
301 Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
 None
 Oven,
Room Temperature
 short
 med
 N/A
 low
301-1 Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
 None
 Oven,
Room Temperature
 short
 med
 N/A
 low
301-2 Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Solar,
Underfill
 None
 Oven,
Room Temperature
 med
 med
 N/A
 low
301-2FL Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
 None
 Oven,
Room Temperature
 long
 low
 N/A
 low
301-2FL-CX Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
 None
 Oven,
Room Temperature
 med
 low
 N/A
 low
301-2FL-T Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
 None
 Oven,
Room Temperature
 med
 low
 med
 low
301-2G Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
 None
 Oven,
Room Temperature
 long
 high
 N/A
 low
302 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
 None
 Room Temperature
 quick
 low
 N/A
 med
302-3M Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
 None
 Oven,
Room Temperature
 short
 med
 N/A
 low
302-3M Black Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
 None
 Oven,
Room Temperature
 short
 med
 N/A
 med
302-3M-R Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor ,
Underfill
 None
 Oven,
Room Temperature
 short
 med
 N/A
 low
305 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials,
Potting
 None
 Oven,
Room Temperature
 short
 low
 N/A
 low
310M Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
 None
 Oven,
Room Temperature
 short
 low
 N/A
 low
310M Black Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
 None
 Oven,
Room Temperature
 short
 low
 N/A
 med
310M-1 Biocompatible,
Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
 None
 Oven,
Room Temperature
 med
 low
 N/A
 low
310M-2 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
 None
 Oven,
Room Temperature
 short
 low
 N/A
 low
310T-M Circuit / Electronic Assembly,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
 None
 Oven,
Room Temperature
 short
 low
 med
 low
314 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Underfill
 None
 Oven
 days
 med
 N/A
 low
320 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
 None
 Oven,
Room Temperature
 short
 med
 high
 low
320-3 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
 None
 Oven
 days
 med
 med
 med
320LV Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
 None
 Oven,
Room Temperature
 short
 med
 N/A
 low
320NC Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
 None
 Room Temperature
 short
 low
 N/A
 low
320NC-2 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
 None
 Oven,
Room Temperature
 short
 low
 med
 low
323LP Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
 None
 Oven
 long
 high
 N/A
 med
323LP-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
 None
 Oven
 long
 high
 N/A
 med
Display Num
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Spotlight

Enhanced Dispensing Product Line
(-D Adhesives)  

Epoxy Technology has developed a significantly improved engineering manufacturing process method, designed for increased reliability for high volume dispensing applications. This is an improved manufacturing process, not a formulation change, allowing optimal dispensing using various types of dispensing equipment, including jetting. With this improvement, all products enhanced by this new method will have the added designation/listing of "-D" products, to signify their unique dispensing advantages. To learn more, click here.


Featured Products
EPO-TEK®  H20E-D
Applications:  Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Conductivity:  Electrical,
Thermal,
Cure: Oven,
Snap,
Potlife:  days
Viscosity:  low
Thixo:  high
Market:  Electronics Assembly,
Hybrid,
Semiconductor,
Tg:  med
MSDS:  
Data Sheet:  
Notes:  
read more
EPO-TEK®  H20S-D
Applications:  Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
Wafer Level,
Conductivity:  Electrical,
Thermal,
Cure: Oven,
Snap,
Potlife:  days
Viscosity:  low
Thixo:  high
Market:  Electronics Assembly,
Hybrid,
Semiconductor,
Solar,
Tg:  med
MSDS:  
Data Sheet:  
Notes:  
read more
EPO-TEK®  H20E-PFC-D
Applications:  Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Conductivity:  Electrical,
Thermal,
Cure: Oven,
Potlife:  days
Viscosity:  med
Thixo:  high
Market:  Electronics Assembly,
Hybrid,
Semiconductor,
Tg:  med
MSDS:  
Data Sheet:  
Notes:  
read more
EPO-TEK®  EK1000-1-D
Applications:  Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Conductivity:  Electrical,
Thermal,
Cure: Oven,
Potlife:  days
Viscosity:  low
Thixo:  med
Market:  Electronics Assembly,
General,
Hybrid,
Semiconductor,
Solar,
Tg:  low
MSDS:  
Data Sheet:  
Notes:  
read more


Press Releases

Epoxy Technology, Inc. announces a comprehensive (MED) line of Biocompatible Adhesives, tested to the most stringent ISO 10993 Testing Method

(Billerica, MA) – January 24, 2019- - Epoxy Technology Inc, a leading manufacturer of high performance specialty epoxy, UV & Hybrid adhesives for over 52 years, is pleased to announce the completion of ISO 10993 testing of its previously Class VI adhesives, as well as the significant addition of 12 new Medical device grade adhesives, to extend its MED line of biocompatible products to 23.

Read more...

Arsenal Capital Partners Acquires Epoxy Technology; Second Acquisition of Meridian Adhesives Group

(New York) – June 6, 2018- Arsenal Capital Partners (“Arsenal”), a leading private equity firm that invests in middlemarket specialty industrials and healthcare business services companies, announced today the acquisition of Epoxy Technology, Inc. (“Epoxy Tech”), a leading manufacturer of high-performance specialty epoxy, ultraviolet, and hybrid adhesives.

Read more...

Epoxy Technology Inc. Announces a New U.S. Authorized Representative – The IPS Group

(Billerica, MA) – July 6, 2017- Epoxy Technology Inc., a leading manufacturer of high performance specialty epoxy, UV & Hybrid adhesives for over 50 years, introduces a new, authorized sales representative company: The IPS Group, covering Arkansas, Louisiana, Oklahoma and Texas. 

Read more...

Epoxy Technology Inc. Announces New Literature for Jewelry and Watch Markets

(Billerica, MA) – June 28, 2017- Epoxy Technology Inc., a leading manufacturer of high performance specialty epoxy, UV & Hybrid adhesives for over 50 years, introduces new literature to showcase the features and benefits of using EPO-TEK® adhesives in Jewelry and Watch applications.

 

Read more...

Epoxy Technology Inc. Announces 50 Years of Adhesive Excellence

(Billerica, MA) – February 17, 2016- Epoxy Technology Inc, a leading manufacturer of high performance specialty epoxy, UV & Hybrid adhesives is celebrating 50 years of adhesive innovation and excellence.  Since 1966, EPO-TEK® products have been synonymous with high performance and reliability.  EPO-TEK adhesives are routinely specified by design engineers world-wide for critical assembly project in a multitude of industries.

Read more...


EPO-TEK Blog Posts
Let's Talk Epoxy With EPO-TEK®

  • Are You Properly Curing UV Adhesives?

    By Mark BusaSales & MarketingEpoxy Technology, Inc.UV curing adhesives offer a convenient way to quickly cure an adhesive in specific applications.  In order to receive the full benefits of UV curing products, it is very important to cure these materials properly.  Below are some important questions to take into consideration...

  • Effects of Relative Humidity and Temperature on Room Temperature Curing ECAs

    By Mavyn HolmanR&D ManagerEpoxy Technology, Inc.Fall has arrived in New England and winter will be here before we know it.  Unfortunately, that means cold temperatures, snow and more importantly for our adhesives - low humidity.  Did you know that maintaining proper humidity levels in your manufacturing environment can play...

  • Insights on How to Work Best with Epoxies from EPO-TEK® Quality Control Department

    By Dawna Bellerose, Quality Control SupervisorUpon receipt of your specialty EPO-TEK adhesive, it’s important to perform an incoming inspection of the product.  This ensures your product was received in good condition.  For optimal results, here are some important insights for receiving and using our products:1.     Make sure the product...

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