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Product Detail

H61-110
General
None
Oven
1
28 days
2,000-4,000cPs
@ 100 rpm
≥110°C
N/A
150°C/1 hr
≥15 kg
N/A
49 x 10-6 in/in/°C (below Tg)
(uncured) 1.5464 @ 589 nm
N/A
83D
N/A
Electronics Assembly,
Hybrid
Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor,
Underfill,
Wafer Level
FAQ
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