Wire Bonding

The use of fine wires to connect semiconductor packages to the next level of packaging. Wires are composed of gold or aluminum.

Wetting

The thorough impregnation of a material by a liquid. The more viscous a fluid, and the higher its surface tension, the more difficult it is for the liquid to “wet” materials. Certain additives, for example, water softeners, reduce surface tension, or viscosity and improve wetting properties, allowing the material to flow out more.

Wavelength Isolation

A WDM’s isolation of a light signal in the desired optical channel from the unwanted optical channels. Also called far-end crosstalk.

Wetting Balance

An instrument used to measure wetting forces, and consequently, estimate solderability.

Wavelength

The distance between points of corresponding phase of two consecutive cycles of a wave. The wavelength is related to the propagation velocity, and the frequency. It is indirectly proportional to frequency.

Working life

The period of time during which an epoxy after mixing with a curing agent, remains workable and suitable for use.

Whisker

A metallic growth, needle-like in size, that appears on the surface of a PCB.

Yield Strength

The load in pounds per square inch where the material under test begins to change dimensions and will not completely recover when the load is removed. Yield strength will normally be lower than ultimate strength. Generally speaking, the more rigid a material is, the closer will be yield and ultimate strengths. Furthermore, the more resilient a material is, the greater the spread between yield and ultimate strengths.

V

Volt. Unit of eletric potential, also known as electromotive force. Represents the potencial difference between two points of a conducting wire carrying a constant current of 1 ampere when the power dissipated between these points is equal to 1 watt.

Viscosity

The property of resistance to flow exhibited within the body of a fluid. Usually measured in centipoise.