Click on the file name to download the technical paper.
Epoxy Crystallization
Why does crystallization occur and recommendations to solve it. |
Tech Paper 65.pdf |
High Frequency Properties of Passive Materials for Ultrasonic Transducers
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Tech Paper 64.pdf |
A Three axis micropositioner for ultrahighvacuum use based on the inertial slider principle
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Tech Paper 63.pdf |
Fabricating Large Arrays of Microwells with Arbitrary Dimensions and Filling Them Using Discontinuous Dewetting
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Tech Paper 62.pdf |
Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment
Screen printable wafer coatings have many advantages over tradition spin-on passivation materials. EPO-TEK T3084-A2A and T3084A3A |
Tech Paper 61.pdf |
Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology
Epoxy Adhesives can separate or "bleed". Gas plasma can prevent this unpredictable phenomena. |
Tech Paper 60.pdf |
Compatibility of Medical Devices and Materials with low-Temperature Hydrogen Peroxide Gas Plasma
Various sterilation processes have different effects on materials and devices. Includes a list of possible adhesives. |
Tech Paper 59.pdf |
Luxeon Emitter Assembly Information
Thermal Management criteria when designing new Emitters for Power Light Sources. |
Tech Paper 56.pdf |
P-45: Assembly of an XGA 0.9" LCoS Display using Inorganic Alignment Layers for VAN LC
A new assembly process for LCoS microdisplays that enables high contast, fast display devices when using VAN LC mode. |
Tech Paper 55.pdf |
Reliability and Degradtion of Organic Light Emitting Devices
By studying the degradation of a population of OLED's, the paper shows that the lifetime of encapsulated devices is increased by more than two orders of magnitude. Princeton University 1994 |
Tech Paper 54.pdf |
Composite Ultrasound Arrays for Operation Above 20 MHz
Methods for fabricating high frequency 2-2 arrays. Penn State University. 1999 SPIE |
Tech Paper 53.pdf |
A Compact Ultrasonic Transducer using the Active Piezoceramic Material as an Electronic Carrier
The integration of sensors and electronics. Ultrasonic Transducer use active piezo. Sweden |
Tech Paper 52.pdf |
Epoxies for OptoElectronic Packaging: Applications and Material Propperties
Materials used in the Assembly of OptoElectronic Packaging |
Tech Paper 51.pdf |
SMT Adhesive Dispensing
Discusses basic adhesive dispensing techniques as well as equipment, methods, environmental factors and materials. |
Tech Paper 50.pdf |
Bandwidth: Performance and Control in Multimode Fiber
Introduction to Fiber Optics/Bandwidth |
Tech Paper 49.pdf |
Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging
Thermal Resistance/ThK 29 W/m°K |
Tech Paper 48.pdf |
Study of RF Flip-Chip Assembly with Underfill Epoxy
Increased reliability from 1,300 to 11,000 fatigue cycles when using EPO-TEK U300 |
Tech Paper 47.pdf |
Re-working, Removing, and “Decapsulating” Cured Epoxy
Methods to remove cured epoxy |
Tech Paper 46.pdf |
Solder Joints vs. Conductive Adhesive bonds: A Direct Comparison for SMT Packaging Technologies
EPO-TEK EE165-3 for CSMA applications |
Tech Paper 45.pdf |
Statistical Process Control Applied to Automated Dispense of Silver Filled Epoxy for Commercial Millimeter Wave Multi Chip Module
EPO-TEK H35-175MP in high volume dispense applications and is capable for high frequency applications at 28 GHz frequency |
Tech Paper 43.pdf |
Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications
Key attributes for designing and formulating advanced thermally conductive epoxies |
Tech Paper 42.pdf |
Wafer Protection with Screen Printable Polyimide
Advantages of screen printing method for wafer surface protection over other techniques. GB 41 |
Tech Paper 41.pdf |
Selecting Epoxies for Optical and Fiber Optic Applications
Critical physical and performance characteristics of epoxies used in optical and fiber optic applications. GB56 |
Tech Paper 40.pdf |
Die Attach Adhesives:A Guide to Material Properties and Applications
Guide to selection of die attach adhesives. GB 48 |
Tech Paper 39.pdf |
The Suitability of Epoxy-Based Adhesives for use in Medical Devices
An overview of adhesives in medical applications. GB 63 |
Tech Paper 38.pdf |
A Practical Approach to Die Attach Adhesive Selection
MIL-STD 883/5011 Conductive Adhesives |
Tech Paper 28.pdf |
Die Attach Vce SAT & EJC Performance
Saturation voltage and thermal resistance performance of die attach adhesives |
Tech Paper 27.pdf |
Adhesives for Microelectronics
Discuss compliance to MIL-A-87172 |
Tech Paper 26.pdf |
Adhesives for Military Hybrids
The strengths and limitations of adhesives recently developed to comply for with military specifications |
Tech Paper 25.pdf |
Chip Protection on Tape Automated Bonding
EPO-TEK H70E-2 for T.A.B. bonding |
Tech Paper 24.pdf |
Recent Advances Made in Die-Attach Adhesives for Microelectronic Applications
EPO-TEK H20E-175, H35-175 |
Tech Paper 23.pdf |
Long Term Strength Characteristics of Conductive Epoxies
A study to report creep behavior, predicting operational life time, and comparison of mechanical & electrical characteristics. EPO-TEK H20E, H2lD |
Tech Paper 22.pdf |
EPO-TEK H20E Conductive Epoxy: The Effects of Mix Ratio & Pot Age on Electrical & Mechanical Performance
How mix ratio effects properties |
Tech Paper 21.pdf |
A Performance Evaluation of a High Density Hermetic Assembly Using Die Attachment
Evaluation of hi rel hermetic I.C. packaging under various stress conditions. EPO-TEK H20E |
Tech Paper 20.pdf |
Thermal Effect of Die Bond Voids
Effect of die bond voids on thermal performance of ceramic, metal, and plastic packages |
Tech Paper 19.pdf |
The Effect of Porosity on Mechanical, Electrical & Thermal Characteristics of Cond. Die Attach Adhesives
Comparison of EPO-TEK materials with others for die attach. Results include volatile materials, die & lap shear, outgassing , electricals. EPO-TEK H20E, B/9028 |
Tech Paper 18.pdf |
Conductive Epoxy Solves Surface Mount Problems
CSMA's to bond surface mount components. EPO-TEK H20E, H70E-4 |
Tech Paper 17.pdf |
Outgassing Characteristics of Conductive Die Attach Materials as a Function of Metallic Filler
Epoxy outgassing effects as a function of different metallic fillers; modified polyimide, pure polyimide, silver, gold, copper, nickel, palladium/silver |
Tech Paper 15.pdf |
Current Technology of Die Attach Materials - Epoxy or Polyimide
Comparisons of Epoxy vs. Polyimides; physical, mechanical, electrical properties; EPO-TEK H20E, H27D, P-7, P-1011. |
Tech Paper 14.pdf |
Epoxy Bleedout in Ceramic Chip Carriers
What resin “bleedout” is and how to avoid it, experimental procedures and control of resin bleedout. EPO-TEK H20E. James Ireland Bleedout paper. |
Tech Paper 12.pdf |
Epoxy Techniques for Hybrid Microwave Integrated Circuits
H20E, H72 - epoxies at microwave frequencies on hybrid devices, eutectic vs epoxy substrate bonding, techniques of application |
Tech Paper 04.pdf |
Adhesive Application Guide
Explanation of Adhesive Properties & Testing |
Adhesive Application Guide.pdf |
