Click on the file name to download the archived technical paper.
The Resurgence of LCOS Displays
Brillian Corp. EPO-TEK T7109-14. Liquid crystal on silicon technology is a compelling display option. |
Tech Paper 58.pdf |
Electrical Conductivity of Ferritin Proteins by Conductive AFM
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Tech Paper 57.pdf |
On The Road To Solder Replacement… An Update On The Technology and Applications
Process and reliability characteristics of ECA's used in flip chip bumping and SMT applications |
Tech Paper 44.pdf |
Reliability of Smart Card/IC Modules Assembled Using PFC Packaging
PFC assembly operations |
Tech Paper 37.pdf |
Technology Assessment: PFC
Polymer Flip Chip (PFC) Solderless Bump Process. GB31 |
Tech Paper 36.pdf |
Applying Conductive Polymer Flip Chip, PFC, connector Technology to MCM’s
Alternatives to wire bonding in connecting thin film resistor networks to alumina substrates |
Tech Paper 35.pdf |
Fabrication & Assembly Process for Solderless PFC
High resolution screen printing/stenciling conductive & dielectric polymers for bump flip chip interconnects |
Tech Paper 34.pdf |
Evaluation of Isotropic Conductive Adhesives for Solder Replacement
Study to assess suitability of isotropic adhesives intended for replacement of lead bearing solders |
Tech Paper 33.pdf |
Simple Packaging Process for Chemical Sensors
Packaging process for silicon-based chemical arrays |
Tech Paper 32.pdf |
Polymer Flip Chip, PFC technology assessment of solderless bump process and reliability
PFC Interconnect Technology increases I/O connections - semiconductor devices |
Tech Paper 31.pdf |
Environmental & Reliability Testing of Conductive Polymer PFC Assemblies
Comparative mechanical, electrical, environmental performance for PFC interconnects |
Tech Paper 30.pdf |
Solderless Flip Chip
ECA's play a key role in Solderless Flip Chip Technology |
Tech Paper 29.pdf |
Computer Designed, Multi-layer Hybrid Substrate using Thick Film Technology
Screenprinting multilayer designs using TFT. EPO-TEK H20E, H77 vs Cermalloy |
Tech Paper 16.pdf |
Skin Problems - A Top Job Hazard
Precautions and preventative procedures of skin dermatitis |
Tech Paper 13.pdf |
The Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications
Methods to determine Tg, the influence of cure schedule on Tg, Tg vs. Cure. EPO-TEK 301, 301-2, 330, 353ND, 377, 360ST, 360T |
Tech Paper 11.pdf |
The Significance of Glass Transition Temperature on Electrically Conductive Epoxy Resins in Hybrid Microelectronics
Methods to determine Tg, the influence of cure schedule on Tg, Tg vs. Cure. EPO-TEK H20E, H21D, H27D, H81 |
Tech Paper 10.pdf |
What Next for Epoxies
Versatality of epoxies |
Tech Paper 09.pdf |
Considerations in Selecting Electrically Conductive Epoxies for Die Bonding
How to select the best ECA |
Tech Paper 08.pdf |
Substrate Attach Epoxies
H74 vs Ablebond et al. - (Procedures) insulative adhesives - ceramic to gold-plated Kovar, and ceramic to ceramic, |
Tech Paper 07.pdf |
Epoxy Device Bonding & Die Handling Techniques for Hybrid Microcircuits
H40, H41, H43, H61, H74 - epoxies in high rel microcircuits, hermetic sealing, epoxy vs eutectic, assembly techniques for hybrids |
Tech Paper 06.pdf |
Electrically Conductive Epoxies for Screen Printing Applications
H20E, H31 - mfg. related problems in screen printing conductive epoxies for die attach |
Tech Paper 05.pdf |
Advances in Epoxy Die Attach
Epoxies for die & substrate attachment, TGA, DTA, curing, mechanical advantages, reliability, performance |
Tech Paper 03.pdf |
Use of Conductive Epoxies for Die Attach
H20E, H31D for die attach, semiconductor chips, lap shear, volume resistivity, thermal resistance and analysis, TMA & TGA |
Tech Paper 02.pdf |
New Epoxy Systems for Microelectronics
H20E - comparison; 1 & 2 component, electrically conductive systems, eutectic vs. epoxy, outgassing, die attach, LED, current density, lap shear, saturation voltage, thermal resistance |
Tech Paper 01.pdf |
