Click on the file name to download the technical paper.
High Frequency Properties of Passive Materials for Ultrasonic Transducers
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Tech Paper 64.pdf |
A Three axis micropositioner for ultrahighvacuum use based on the inertial slider principle
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Tech Paper 63.pdf |
Fabricating Large Arrays of Microwells with Arbitrary Dimensions and Filling Them Using Discontinuous Dewetting
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Tech Paper 62.pdf |
Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment
Screen printable wafer coatings have many advantages over tradition spin-on passivation materials. EPO-TEK T3084-A2A and T3084A3A |
Tech Paper 61.pdf |
Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology
Epoxy Adhesives can separate or "bleed". Gas plasma can prevent this unpredictable phenomena. |
Tech Paper 60.pdf |
Compatibility of Medical Devices and Materials with low-Temperature Hydrogen Peroxide Gas Plasma
Various sterilation processes have different effects on materials and devices. Includes a list of possible adhesives. |
Tech Paper 59.pdf |
The Resurgence of LCOS Displays
Brillian Corp. EPO-TEK T7109-14. Liquid crystal on silicon technology is a compelling display option. |
Tech Paper 58.pdf |
Electrical Conductivity of Ferritin Proteins by Conductive AFM
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Tech Paper 57.pdf |
Luxeon Emitter Assembly Information
Thermal Management criteria when designing new Emitters for Power Light Sources. |
Tech Paper 56.pdf |
P-45: Assembly of an XGA 0.9" LCoS Display using Inorganic Alignment Layers for VAN LC
A new assembly process for LCoS microdisplays that enables high contast, fast display devices when using VAN LC mode. |
Tech Paper 55.pdf |
Reliability and Degradtion of Organic Light Emitting Devices
By studying the degradation of a population of OLED's, the paper shows that the lifetime of encapsulated devices is increased by more than two orders of magnitude. Princeton University 1994 |
Tech Paper 54.pdf |
Composite Ultrasound Arrays for Operation Above 20 MHz
Methods for fabricating high frequency 2-2 arrays. Penn State University. 1999 SPIE |
Tech Paper 53.pdf |
A Compact Ultrasonic Transducer using the Active Piezoceramic Material as an Electronic Carrier
The integration of sensors and electronics. Ultrasonic Transducer use active piezo. Sweden |
Tech Paper 52.pdf |
Epoxies for OptoElectronic Packaging: Applications and Material Propperties
Materials used in the Assembly of OptoElectronic Packaging |
Tech Paper 51.pdf |
SMT Adhesive Dispensing
Discusses basic adhesive dispensing techniques as well as equipment, methods, environmental factors and materials. |
Tech Paper 50.pdf |
Bandwidth: Performance and Control in Multimode Fiber
Introduction to Fiber Optics/Bandwidth |
Tech Paper 49.pdf |
Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging
Thermal Resistance/ThK 29 W/m°K |
Tech Paper 48.pdf |
Study of RF Flip-Chip Assembly with Underfill Epoxy
Increased reliability from 1,300 to 11,000 fatigue cycles when using EPO-TEK U300 |
Tech Paper 47.pdf |
Re-working, Removing, and “Decapsulating” Cured Epoxy
Methods to remove cured epoxy |
Tech Paper 46.pdf |
Solder Joints vs. Conductive Adhesive bonds: A Direct Comparison for SMT Packaging Technologies
EPO-TEK EE165-3 for CSMA applications |
Tech Paper 45.pdf |
On The Road To Solder Replacement… An Update On The Technology and Applications
Process and reliability characteristics of ECA's used in flip chip bumping and SMT applications |
Tech Paper 44.pdf |
Statistical Process Control Applied to Automated Dispense of Silver Filled Epoxy for Commercial Millimeter Wave Multi Chip Module
EPO-TEK H35-175MP in high volume dispense applications and is capable for high frequency applications at 28 GHz frequency |
Tech Paper 43.pdf |
Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications
Key attributes for designing and formulating advanced thermally conductive epoxies |
Tech Paper 42.pdf |
Wafer Protection with Screen Printable Polyimide
Advantages of screen printing method for wafer surface protection over other techniques. GB 41 |
Tech Paper 41.pdf |
Selecting Epoxies for Optical and Fiber Optic Applications
Critical physical and performance characteristics of epoxies used in optical and fiber optic applications. GB56 |
Tech Paper 40.pdf |
Die Attach Adhesives:A Guide to Material Properties and Applications
Guide to selection of die attach adhesives. GB 48 |
Tech Paper 39.pdf |
The Suitability of Epoxy-Based Adhesives for use in Medical Devices
An overview of adhesives in medical applications. GB 63 |
Tech Paper 38.pdf |
Reliability of Smart Card/IC Modules Assembled Using PFC Packaging
PFC assembly operations |
Tech Paper 37.pdf |
Technology Assessment: PFC
Polymer Flip Chip (PFC) Solderless Bump Process. GB31 |
Tech Paper 36.pdf |
Applying Conductive Polymer Flip Chip, PFC, connector Technology to MCM’s
Alternatives to wire bonding in connecting thin film resistor networks to alumina substrates |
Tech Paper 35.pdf |
Fabrication & Assembly Process for Solderless PFC
High resolution screen printing/stenciling conductive & dielectric polymers for bump flip chip interconnects |
Tech Paper 34.pdf |
Evaluation of Isotropic Conductive Adhesives for Solder Replacement
Study to assess suitability of isotropic adhesives intended for replacement of lead bearing solders |
Tech Paper 33.pdf |
Simple Packaging Process for Chemical Sensors
Packaging process for silicon-based chemical arrays |
Tech Paper 32.pdf |
Polymer Flip Chip, PFC technology assessment of solderless bump process and reliability
PFC Interconnect Technology increases I/O connections - semiconductor devices |
Tech Paper 31.pdf |
Environmental & Reliability Testing of Conductive Polymer PFC Assemblies
Comparative mechanical, electrical, environmental performance for PFC interconnects |
Tech Paper 30.pdf |
Solderless Flip Chip
ECA's play a key role in Solderless Flip Chip Technology |
Tech Paper 29.pdf |
A Practical Approach to Die Attach Adhesive Selection
MIL-STD 883/5011 Conductive Adhesives |
Tech Paper 28.pdf |
Die Attach Vce SAT & EJC Performance
Saturation voltage and thermal resistance performance of die attach adhesives |
Tech Paper 27.pdf |
Adhesives for Microelectronics
Discuss compliance to MIL-A-87172 |
Tech Paper 26.pdf |
Adhesives for Military Hybrids
The strengths and limitations of adhesives recently developed to comply for with military specifications |
Tech Paper 25.pdf |
Chip Protection on Tape Automated Bonding
EPO-TEK H70E-2 for T.A.B. bonding |
Tech Paper 24.pdf |
Recent Advances Made in Die-Attach Adhesives for Microelectronic Applications
EPO-TEK H20E-175, H35-175 |
Tech Paper 23.pdf |
Long Term Strength Characteristics of Conductive Epoxies
A study to report creep behavior, predicting operational life time, and comparison of mechanical & electrical characteristics. EPO-TEK H20E, H2lD |
Tech Paper 22.pdf |
EPO-TEK H20E Conductive Epoxy: The Effects of Mix Ratio & Pot Age on Electrical & Mechanical Performance
How mix ratio effects properties |
Tech Paper 21.pdf |
A Performance Evaluation of a High Density Hermetic Assembly Using Die Attachment
Evaluation of hi rel hermetic I.C. packaging under various stress conditions. EPO-TEK H20E |
Tech Paper 20.pdf |
Thermal Effect of Die Bond Voids
Effect of die bond voids on thermal performance of ceramic, metal, and plastic packages |
Tech Paper 19.pdf |
The Effect of Porosity on Mechanical, Electrical & Thermal Characteristics of Cond. Die Attach Adhesives
Comparison of EPO-TEK materials with others for die attach. Results include volatile materials, die & lap shear, outgassing , electricals. EPO-TEK H20E, B/9028 |
Tech Paper 18.pdf |
Conductive Epoxy Solves Surface Mount Problems
CSMA's to bond surface mount components. EPO-TEK H20E, H70E-4 |
Tech Paper 17.pdf |
Computer Designed, Multi-layer Hybrid Substrate using Thick Film Technology
Screenprinting multilayer designs using TFT. EPO-TEK H20E, H77 vs Cermalloy |
Tech Paper 16.pdf |
Outgassing Characteristics of Conductive Die Attach Materials as a Function of Metallic Filler
Epoxy outgassing effects as a function of different metallic fillers; modified polyimide, pure polyimide, silver, gold, copper, nickel, palladium/silver |
Tech Paper 15.pdf |
Current Technology of Die Attach Materials - Epoxy or Polyimide
Comparisons of Epoxy vs. Polyimides; physical, mechanical, electrical properties; EPO-TEK H20E, H27D, P-7, P-1011. |
Tech Paper 14.pdf |
Skin Problems - A Top Job Hazard
Precautions and preventative procedures of skin dermatitis |
Tech Paper 13.pdf |
Epoxy Bleedout in Ceramic Chip Carriers
What resin “bleedout” is and how to avoid it, experimental procedures and control of resin bleedout. EPO-TEK H20E |
Tech Paper 12.pdf |
The Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications
Methods to determine Tg, the influence of cure schedule on Tg, Tg vs. Cure. EPO-TEK 301, 301-2, 330, 353ND, 377, 360ST, 360T |
Tech Paper 11.pdf |
The Significance of Glass Transition Temperature on Electrically Conductive Epoxy Resins in Hybrid Microelectronics
Methods to determine Tg, the influence of cure schedule on Tg, Tg vs. Cure. EPO-TEK H20E, H21D, H27D, H81 |
Tech Paper 10.pdf |
What Next for Epoxies
Versatality of epoxies |
Tech Paper 09.pdf |
Considerations in Selecting Electrically Conductive Epoxies for Die Bonding
How to select the best ECA |
Tech Paper 08.pdf |
Substrate Attach Epoxies
H74 vs Ablebond et al. - (Procedures) insulative adhesives - ceramic to gold-plated Kovar, and ceramic to ceramic, |
Tech Paper 07.pdf |
Epoxy Device Bonding & Die Handling Techniques for Hybrid Microcircuits
H40, H41, H43, H61, H74 - epoxies in high rel microcircuits, hermetic sealing, epoxy vs eutectic, assembly techniques for hybrids |
Tech Paper 06.pdf |
Electrically Conductive Epoxies for Screen Printing Applications
H20E, H31 - mfg. related problems in screen printing conductive epoxies for die attach |
Tech Paper 05.pdf |
Epoxy Techniques for Hybrid Microwave Integrated Circuits
H20E, H72 - epoxies at microwave frequencies on hybrid devices, eutectic vs epoxy substrate bonding, techniques of application |
Tech Paper 04.pdf |
Advances in Epoxy Die Attach
Epoxies for die & substrate attachment, TGA, DTA, curing, mechanical advantages, reliability, performance |
Tech Paper 03.pdf |
Use of Conductive Epoxies for Die Attach
H20E, H31D for die attach, semiconductor chips, lap shear, volume resistivity, thermal resistance and analysis, TMA & TGA |
Tech Paper 02.pdf |
New Epoxy Systems for Microelectronics
H20E - comparison; 1 & 2 component, electrically conductive systems, eutectic vs. epoxy, outgassing, die attach, LED, current density, lap shear, saturation voltage, thermal resistance |
Tech Paper 01.pdf |
Epoxy Technology Certificate of RoHS Compliance
Official RoHS Statement |
Epoxy Technology Certificate of RoHS Compliance.pdf |
