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Click on an image to download the full tech tip sheet. Tech Tips are available in PDF format (Adobe Acrobat Reader is required for viewing):

Tech Tip 1 - Proper Mixing and Handling of Epoxies

tip1

What:

Proper Mixing

Why:

Mixing and handling epoxies properly eases the application process and increases the chances of achieving a good bond.

 

Tech Tip 2 - Handling Premixed and Frozen Materials

tip2

What:

Handling Premixed & Frozen Materials

Why:

Touching the barrel of a frozen syringe without gloves will result in the product pulling away from the barrel and cause freeze thaw voids.

 

Tech Tip 3 - Viscosity and TI

tip3

What:

Viscosity and Thixotropic Index

Why:

Viscosity and TI are important parameters to consider when choosing an epoxy.

 

 

Tech Tip 4 - Removing Bubbles

tip4

What:

Removing Bubbles from Epoxy

Why:

Removing bubbles ensures optimal adhesive performance by providing a good continuous bond.

 

 

Tech Tip 5 - Using Expired Product

tip5

What:

Shelf Life

Why:

A product can be used for certain applications after the date of expiration has passed.

 

 

Tech Tip 6 - Minimum Bond Line

tip6

What:

Minimum Bond Line

Why:

Minimum bond line cure and thickness play an important role in adhesive properties and performance.

 

 

Tech Tip 7 - Epoxy Crystallization

tip7

What:

Epoxy Crystallization

Why:

Crystallization of epoxy resins is completely reversible, like freeze/thaw cycles of ice and water.

 

 

Tech Tip 8 - Reworking Cured Epoxy

tip8

What:

Removing Cured Epoxy

Why:

There are several techniques which have shown to be effective tools in removing cured epoxy from substrates.

 

 

Tech Tip 9 - UV Cure Adhesives

tip9

What:

UV Curing Tips

Why:

UV curing adhesives offer a convenient way to quickly cure a product in specific applications.

 

 

Tech Tip 10 - Component Selections for Optimal Dispensing of Epoxies

tip10

What:

Proper Dispensing Tips

Why:

Selecting the correct syringe (barrel), tip, piston & adapter is crucial for optimal dispensing.

 

 

Tech Tip 11 - Converting Mix Ratios

tip11

What:

Mix ratio by weight to mix ratio by volume

Why:

Large errors can occur when mix ratios are not calculated properly

 

 

Tech Tip 12 - Compatible Metallization

tip12

What:

Compatible Metallization for Silver Epoxies

Why:

Considerations for PCB & circuit assembly when choosing ECAs ahead of solder joining

 

 

Tech Tip 13 - Surface Preparation

tip13

What:

Surface Preparation

Why:

Properly preparing a surface for bonding can increase reliability by optimizing a substrates’ ability to accept the adhesive.

 

 

Tech Tip 14 - Color Variations

tip14

What:

How color can vary in epoxy adhesive components.

Why:

Uncured epoxy color differences do not translate into a change in performance.

 

 

Tech Tip 15 - Room Temp Curing ECAs

tip15

What:

The Effect of Relative Humidity and Temperature on Volume Resistivity for Room Temperature Curing ECAs

Why:

It could be your environment.

 

Tech Tip 16 - Understanding & Preventing Epoxy Resin Bleed

tip16

What:

Understanding and Preventing Epoxy Resin Bleed

Why:

Epoxy bleed-out is a random occurrence not related to epoxies.

 

Tech Tip 17 - Identifying Particles in an Epoxy Adhesive Using Hegman Gauge Analysis

tip17

What:

Hegman gauge helps to identify different potential types of particles within an epoxy

Why:

To identify particle characteristics when subjected to Hegman Gauge analysis

 

Tech Tip 18 - Understanding Optical Properties for Epoxy Applications

tip18

What:

Optical Properties of Epoxy Adhesives

Why:

Index of Refraction & Spectral Transmission play a critical role in optoelectronic applications involving epoxies

 

 

Tech Tip 19 - Understanding Mechanical Properties of Epoxies for FEA

tip19

What:

Mechanical Properties of Epoxies for FEA

Why:

Understanding the properties of epoxies will help in product selection when using FEA

 

Tech Tip 20 - B-stage Epoxy

tip20

What:

Understanding B-stage Epoxy Adhesives

Why:

B-staged epoxy provides many processing advantages in mass production

 

Tech Tip 21 - Epoxy & Silicone Interactions

tip21

What:

Epoxy and Silicone Interactions

Why:

Epoxies and Silicones can co-exist favorably within the same application when applied properly.

 

Tech Tip 22 - Using Mold Release Agents with Epoxy Adhesives

tip22

What:

Mold Release Agents

Why:

Mold release agents work well when used properly with epoxy adhesives.

 

Tech Tip 23 - Tg - Glass Transition Temperature for Epoxies

tip23

What:

Glass Transition Temperature (Tg)

Why:

Tg is an important property of an epoxy, especially critical in product design.

 

Tech Tip 24 - Bonding to Aluminum

What:

Bonding to Aluminum Using Epoxy

Why:

Aluminum, a popular metal has unique physical properties that need to be taken into consideration for proper bonding with epoxy adhesives.

 

 

Tech Tip 25 - Dielectric Properties of Epoxies

What:

Dielectric Properties of Epoxies

Why:

Dielectric materials provide an insulating barrier between two electrical conductors.

 

 

Tech Tip 26 - Pot Life, Working Life and Gel Time of Epoxies

What:

Understanding the terms pot life, working life and gel time with regards to EPO-TEK adhesives.

Why:

Knowing the difference will help with material selection for a specific application.

 

 

Tech Tip 27 - Polyimides

What:

Understanding Polyimides

Why:

Polyimides are high temperature materials with excellent chemical and solvent resistance

 

 

Tech Tip 28 - Amine Blush

What:

Amine Blush with Epoxies

Why:

Amine blush can
be avoided with appropriate
precautions.

 

 

 

Tech Tip 29 - Gamma Sterilization for Medical Devices and its Effect on Epoxies

What:

Gamma Sterilization for Medical Devices and its Effect on Epoxies

Why:

Irradiation can cause some changes to epoxies.

 

 

 

Tech Tip 30 - Understanding How to Choose an Appropriate Thermally Conductive Epoxy

What:

Understanding how to choose a thermally conductive epoxy

Why:

Knowing how to choose an appropriate thermally conductive epoxy will lead to the best thermal performance in a final device.

 

 

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