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EPO-TEK®
Technical Papers
& Summaries

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Tech Paper #4
Epoxy Techniques for Hybrid Microwave Integrated Circuits

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Tech Paper #12
Epoxy Bleed Out in Ceramic Chip Carriers

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Tech Paper #13
Skin Problems – A Top Job Hazard Precautions and Preventative Procedures of Skin Dermatitis

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Tech Paper #20
High Density Hermetic Assembly Using Die Attachment

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Tech Paper #21
EPO-TEK® H20E Conductive Epoxy: The Effects of Mix Ratio and Pot Age on Electrical and Mechanical Performance

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Tech Paper #22
Long Term Strength Characteristics of Conductive Epoxies

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Tech Paper #24
Chip Protection in Tape Automated Bonding

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Tech Paper #38
The Suitability of Epoxy-Based Adhesives for use in Medical Devices An overview of adhesives in medical applications.

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Tech Paper #41
Wafer Protection with Screen Printable Polyimide

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Tech Paper #42
Advanced Boron Nitride Epoxy Formulations Excel In Thermal Management Applications

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Tech Paper #43
Statistical Process Control Applied to Automated Dispense of Silver Filled Epoxy for Commericial Millimeter Wave Multi Chip Module

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Tech Paper #45
Solder Joints Vs. Conductive Adhesive Bonds: A Direct Comparison for SMT Packaging Technologies

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Tech Paper #47
Study of RF Flip-Chip Assembly with Underfill Epoxy

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Tech Paper #48
Conductive Adhesives for Thermal Management; Case Study in Hybrid Microelectronics and Plastic IC Packaging

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Tech Paper #50
SMT Adhesive Dispensing

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Tech Paper #51
Epoxies for OptoElectronic Packaging: Applications and Material Properties

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Tech Paper #52
A Compact Ultrasonic Transducer Using the Active Piezoceramic Material as Electronics Carrier

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Tech Paper #53
Composite Ultrasound Arrays for Operation Above 20 MHz

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Tech Paper #54
Reliability and Degradation of Organic Light Emitting Devices

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Tech Paper #55
P-45: Assembly of an XGA 0.9” LCoS Display using Inorganic Alignment Layers for VAN LC

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Tech Paper #56
Luxeon Emitter Assembly Information Thermal Management criteria when designing new Emitters for Power Light Sources

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Tech Paper #59
Compatibility of Medical Devices and Materials with Low Temperature Hydrogen Peroxide Gas Plasma

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Tech Paper #60
Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology

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Tech Paper #61
Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment

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Tech Paper #62
Fabricating Large Arrays of Microwells with Arbitrary Dimensions and Filling Them Using Discontinuous Dewetting

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Tech Paper #63
A Three Axis Micropositioner for Ultrahigh Vacuum Use Based on the Inertial Slider Principle

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Tech Paper #64
High Frequency Properties of Passive Materials for Ultrasonic Transducers

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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
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    Date Event Booth Location
    2017
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    07-12  to  07-13 UK Semiconductors TBA Sheffield - UK
    07-13  to  07-15 China Electronics Fair West Show Chengdu - China
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    09-20  to  09-22 Medtec China K408 Shanghai - China
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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