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EPO-TEK® Glossary Of Terms

 

W
See Watt.
Waffle Pack
A matrix tray for holding bare die. Typically, waffle packs are 2" x 2" or 4" x 4." The pockets for die in waffle packs are typically designed for specific die sizes; they are not standardized.
WAN
See wide area network.
Watt
Linear measurement of optical power, usually expressed in milhwatts, microwatts, and nanowatts.
Wave Cleaning
Cleaning a PCB by passing it through a wave of solvents (similar to the concept used in a wave fluxer or a wave soldering process).
Wave Soldering
A process in which many potential solder joints are brought in contact with a wave of molten solder for a short period of time and are soldered simultaneously.
Waveguide
A system or material designed to confine and direct electromagnetic waves in a direction determined by its physical boundaries.
Wavelength
The distance between points of corresponding phase of two consecutive cycles of a wave. The wavelength is related to the propagation velocity, and the frequency. It is indirectly proportional to frequency.
Wavelength Isolation
A WDM's isolation of a light signal in the desired optical channel from the unwanted optical channels. Also called far-end crosstalk.
Wetting
The thorough impregnation of a material by a liquid. The more viscous a fluid, and the higher its surface tension, the more difficult it is for the liquid to "wet" materials. Certain additives, for example, water softeners, reduce surface tension, or viscosity and improve wetting properties, allowing the material to flow out more.
Wetting Balance
An instrument used to measure wetting forces, and consequently, estimate solderability.
Whisker
A metallic growth, needle-like in size, that appears on the surface of a PCB.
Wire Bonding
The use of fine wires to connect semiconductor packages to the next level of packaging. Wires are composed of gold or aluminum. Z-Axis Conductive Epoxy
Working life
The period of time during which an epoxy after mixing with a curing agent, remains workable and suitable for use.
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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
    05-02  to  05-02 iMAPS New England Tabletop Boxborough, MA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    05-23  to  05-25 SID 1145 Los Angeles, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
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    India
    Italy
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    Singapore
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    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    04-25  to  04-27 Semicon Southeast Asia D1 Penang - Malaysia
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    07-13  to  07-15 China Electronics Fair West Show Chengdu - China
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
    03-29  to  03-30 LOPEC B0/403 Munich - Germany
    04-04  to  04-06 Medtec 1/1H45 Stuttgart - Germany
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    05-10  to  05-11 Lab-on-a-Chip and Microfluidics C16 Munich - Germany
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    04-26  to  04-27 Fraunhofer CAM Workshop 13 Halle - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    04-05  to  04-07 NEPCON G123 Seoul - Korea
    09-20  to  09-22 Medtec China K408 Shanghai - China
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