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EPO-TEK® Glossary Of Terms

 

T Tera.
One trillion.
TAB Component
An IC mounted on a TAB site.
Tape Automated Bonding (TAB)
The process where silicon chips are joined to patterned metal traces (leads) on polymer tape to form inner leads bonds and subsequently the leads are attached to the next level of the assembly, typically a substrate or board, to form outer lead bonds. TAB is the technique of interconnecting silicon with beam bonding as opposed to wire bonding.
Tape Ball Grid Array (TBGA)
A BGA package on a copper polyimide base like TAB, except TAB leads are replaced by an area array ball grid for interconnects. A stiffener is added to ensure flatness for the mass reflow assembly process.
Tape Bonding
Utilization of a metal or plastic tape material as a support to a carrier of a component in a gang bonding process.
TEC
Abbreviation for thermoelectric cooler.
Temperature, Curing
The temperature to which an adhesive or an assembly is subjected to cure the adhesive. Note-The temperature attained by the adhesive in the process of setting it may differ from the temperature of the atmosphere surrounding the assembly.
Tensile Strength
The pulling force necessary to break a given specimen divided by the cross sectional area. Units given in lbs./in/2 (P.S.I.). It measures the resistance of a material to stretching without rupture. Normally is not used with reference to elastic materials which recover after elongation.
Terminal
A metallic device used for making electrical connections.
Test Pattern
A pattern used for inspecting or testing purposes.
Thermal Conductivity
A measure of how rapidly heat is conducted through a material.
Thermal Cycling
A method used to induce stresses on electrical components by means of sequential heating and cooling in an oven. It is used in accelerated reliability testing.
Thermal Noise
Noise resulting from thermally induced random fluctuation in current in the receiver's load resistance.
Thermal Profile
A time versus temperature graph that displays the temperatures an assembly is subjected to over time in an oven during processes such as reflow soldering or the curing of adhesives, encapsulants, and conformal coatings.
Thermal Shock Resistance
The ability of a cured system to resist cracking or crazing under conditions of rapid and continuous thermal change. The 1/4 inch Olyphant Washer test is cycled over a temperature range of -55¡C to +125¡C, this temperature is normally used as the test condition unless otherwise stated.
Thermocompression Bonding
The joining of two materials without an intermediate material by the application of pressure and heat in the absence of electrical current.
Thermoplastic
Polymer materials that can be repeatedly melted without significant change in their properties.
Thermosetting
Describes the property of an epoxy, to set or become rigid and non-meltable when heated with or without pressure.
Thermosetting Plastic
Polymer materials that cure (irreversably polymerize) at specific temperature and time conditions.
Thixotropic Ratio
An indication of thixotropy as a ratio of viscosities at two different shear rates.
Thixotropy
False body. The property of a paste or fluid to thicken or set up to a paste or semi-gel when allowed to stand. Agitation breaks it down but further standing will again permit a viscosity rise. Time, Curing
Torsional Strength
The torque required to separate adhesive bonded (and cured) materials and/or components.
Transceiver
A device that performs, within one chassis, both telecommunicafion transmitting and receiving functions.
Transistor
An active semiconductor device capable of providing power amplification. Transistors have three or more terminals.
Transmitter
A device that includes a source and driving electronics. It functions as an electricalto-optical converter.
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  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    05-23  to  05-25 SID 1145 Los Angeles, CA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
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    Korea
    Malaysia
    Philippines
    Singapore
    Spain
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    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    06-20  to  06-23 EPHJ/EPMT/SMT TBA Geneva - Switzerland
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    07-12  to  07-13 UK Semiconductors TBA Sheffield - UK
    07-13  to  07-15 China Electronics Fair West Show Chengdu - China
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    09-20  to  09-22 Medtec China K408 Shanghai - China
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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