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EPO-TEK® Glossary Of Terms


Abbreviation for second.
Society of Automotive Engineers.
The change of direction of light rays or photons after striking small particles. It may also be regarded as the diffusion of a light beam caused by the non-homogeneity of the transmitting material.
Screen Printing
The transfer of a pattern onto a surface by forcing a suitable material through a screen with a squeegee.
To convert an epoxy into a fixed or hardened state by chemical or physical action through polymerization.
Shear Strength
The shear force required to break a specimen divided by its cross-sectional area; the force being applied parallel to the cross-sectional area.
Shore A Hardness
The reading of a material's hardness on a durometer, the scale of which is 0-100, used on elastomers and other flexible materials. Consists of a pin point depression into the material, the material being at least 100 mils thick. A Shore A reading of 80 equal a Shore D reading of 30.
Shore D Hardness
The reading of a material's hardness on a durometer similar to the Shore A durometer, the scale of which 0-100, used on rigid and semi-rigid materials. Consist of a pin point depression into the material. Both the Shore A and Shore D instruments are made by the Shore Instrument Manufacturing Company, Inc., Jamaica, NY.
An unwanted connection between conductor paths.
The decrease in volume, or contraction, of a material by the escape of any volatile substance, or by a chemical or physical change in the material.
Si Silicon
Generally used in detectors. Good for short wavelengths only (e.g., < 1000 nm).
SI Units
Abbreviation for International System of Units, commonly known as the metric system,
Silica Glass
Glass made mostly of silicon dioxide, SiO2, used in conventional optical fibers.
(SM) Fiber A small-core optical fiber through which only one mode will propagate. The typical diameter is 8-9 microns.
The distance a substance (e.g., an adhesive) moves after it has been applied and cured.
Surface-mount device.
Surface-mount technology.
Softening Range
The range of temperature in which a thermoplastic changes from a rigid to a soft state.
Solids Content
The metal powder content as a percentage of the mass of the wet solder paste.
A solution capable of dissolving a solute.
Solvent Cleaning
A cleaning method employing chlorinated and fluorinated hydrocarbon liquids.
Solvent Extraction
The removal of one or more components from a liquid mixture by intimate contact with a secondary liquid that is nearly insoluble in the first liquid and which dissolves the impurities and not the substance to be purified.
Specific Gravity
The ratio of the weight of any volume of a mass or substance to the weight of an equal volume of water at given temperature. The specific gravity of a substance times the density of water equals the density of the substance.
Specific Heat
The ratio of a material's thermal capacity to that of water at 15¼C.
The distance a substance (e.g., an adhesive) moves after it has been applied at ambient conditions.
A metal mask in which patterns or apertures matching the component locations on the PCB are made so a suitable material can be forced through the apertures by a squeegee onto a substrate.
Stencil Printing
Deposition of a specific material, such as solder paste, using a stencil.
Storage life
The period of time during which a packaged epoxy or curing agent can be stored under specific temperature conditions and remain stable for use. Sometimes called shelf life.
An applied force or pressure, as tension or shear, exerted on a body which produces a resultant strain on the material. The ability of material to withstand a stress depends on the strength of its cohesive force or molecular resistance.
A material upon the surface of which an epoxy is spread for any purpose, such as bonding or coating.
Substrate Geometry
Substrate dimensions, typically dimensions critical to implement a successful bonding process, including the following
Surface Mount Technology
A method of assembling printed circuit boards where the components are mounted onto the surface of the board rather than being inserted into holes in the board.
Surface Resistivity
The resistance to a current flow along the surface of an insulator material. Measure in ohms-cm.
Surface Tension
The property of a liquid which causes the surface to pull into the smallest area for a maximum volume, hence, drops are spherical. The fact that water drops on a wax surface do not spread out due to surface tension. If a wetting agent were to be added to the water the round droplet would spread out into a film because of the lowered surface tension.
Surface-Emitting Diode
An LED that emits light from its flat surface rather than its side. Simple and inexpensive, with emission spread over a wide angle.
A chemical added to any substance to lower its surface tension.
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  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
    03-21  to  03-23 OFC 2917 Anaheim, CA
    05-02  to  05-02 iMAPS New England Tabletop Boxborough, MA
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  3. GLOBAL Tradeshows

    International Tradeshows

    Date Event Booth Location
    04-25  to  04-27 Semicon Southeast Asia D1 Penang - Malaysia
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    03-29  to  03-30 LOPEC B0/403 Munich - Germany
    04-04  to  04-06 Medtec 1/1H45 Stuttgart - Germany
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    05-10  to  05-11 Lab-on-a-Chip and Microfluidics C16 Munich - Germany
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    04-26  to  04-27 Fraunhofer CAM Workshop 13 Halle - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    02-08  to  02-10 SEMICON Korea C 1778 Seoul - Korea
    04-05  to  04-07 NEPCON G123 Seoul - Korea