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EPO-TEK® Glossary Of Terms

 

Laminate
A stack of prepregs with copper foils on either surface after lamination during PCB fabrication.
Lamination
A heat and pressure cycle used to consolidate a stack of prepregs into a solid block. The term also refers to the consolidation of a stack of laminates (with circuitry) to form a PCB. Lamination is referred to as the C-stage in PCB fabrication.
LAN
See local area network.
Large Core Fiber
Usually, a fiber with a core of 200 um or more.
Laser
Acronym for light amplification by stimulated emission of radiation. Lasers usually have low bandwidth and high power. Lasers in fiber optics are usually solid-state semiconductor types.
Laser Diode
A semiconductor that emits coherent light when forward biased.
Leaching
The process during which liquid solder dissolves a metal coating.
Lead
A wire that connects two points in a circuit; it is usually self-supporting.
Lead (Pb)
A soft heavy gray metal used in solder and other alloys.
Lead Frame
A sheet metal framework etched to form an array of metal traces (leads). An IC is attached to the lead frame at the innermost portion of the leads, and the outermost portion of the leads is attached to the next level of the assembly. However, lead frames are the basis for molded carrier ring (MCR) and plastic quad flatpack (PQFP) components, while TAB frames are the basis for TAB components.
Lead Pitch
The sum of the lead width and lead spacing. Typically stated as the distance between the center of one lead to the center of an adjacent lead.
Lead Plating
The metal coating on a component lead. Common lead plating materials are pure tin (Sn), pure gold (Au), and eutectic tin/lead solder (63% Sn/37% Pb).
Lead Spacing
The distance between adjacent leads in a defined area of a component.
Lead Thickness
In reference to component leads, it is the sum of the thickness of the base metal, plating, and total fabrication tolerances. Lead thickness is a critical element in determining the dimensions and proper clearances in excise and form tooling.
Lead Width
The width of the lead in a defined area of a component.
Leaded Device
Electronic devices that have electrical leads extending from the body of the package.
Leadless Device
Electronic devices which do not have electrical leads extending from the body of the package. These packages could have solder bumps or lands located on the package.
Leakage Current
A small amount of current that flows through or across an insulator between two electrodes.
LED
Light Emitting Diode. LEDs work on the principle of spontaneous emission of light as opposed to stimulated emission. LEDs usually have high bandwidth but relatively low power. LEDs operate in the infrared, visible and ultraviolet regions of the optical spectrum.
Lightguide
Synonym optical fiber
Loss
The amount of a signal's power, expressed in dB, that is lost in connectors, splices, or fiber defects.
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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
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    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    09-20  to  09-22 Medtec China K408 Shanghai - China
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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