EPO-TEK 50th gold Logo


EPO-TEK® Glossary Of Terms

 

Laminate
A stack of prepregs with copper foils on either surface after lamination during PCB fabrication.
Lamination
A heat and pressure cycle used to consolidate a stack of prepregs into a solid block. The term also refers to the consolidation of a stack of laminates (with circuitry) to form a PCB. Lamination is referred to as the C-stage in PCB fabrication.
LAN
See local area network.
Large Core Fiber
Usually, a fiber with a core of 200 um or more.
Laser
Acronym for light amplification by stimulated emission of radiation. Lasers usually have low bandwidth and high power. Lasers in fiber optics are usually solid-state semiconductor types.
Laser Diode
A semiconductor that emits coherent light when forward biased.
Leaching
The process during which liquid solder dissolves a metal coating.
Lead
A wire that connects two points in a circuit; it is usually self-supporting.
Lead (Pb)
A soft heavy gray metal used in solder and other alloys.
Lead Frame
A sheet metal framework etched to form an array of metal traces (leads). An IC is attached to the lead frame at the innermost portion of the leads, and the outermost portion of the leads is attached to the next level of the assembly. However, lead frames are the basis for molded carrier ring (MCR) and plastic quad flatpack (PQFP) components, while TAB frames are the basis for TAB components.
Lead Pitch
The sum of the lead width and lead spacing. Typically stated as the distance between the center of one lead to the center of an adjacent lead.
Lead Plating
The metal coating on a component lead. Common lead plating materials are pure tin (Sn), pure gold (Au), and eutectic tin/lead solder (63% Sn/37% Pb).
Lead Spacing
The distance between adjacent leads in a defined area of a component.
Lead Thickness
In reference to component leads, it is the sum of the thickness of the base metal, plating, and total fabrication tolerances. Lead thickness is a critical element in determining the dimensions and proper clearances in excise and form tooling.
Lead Width
The width of the lead in a defined area of a component.
Leaded Device
Electronic devices that have electrical leads extending from the body of the package.
Leadless Device
Electronic devices which do not have electrical leads extending from the body of the package. These packages could have solder bumps or lands located on the package.
Leakage Current
A small amount of current that flows through or across an insulator between two electrodes.
LED
Light Emitting Diode. LEDs work on the principle of spontaneous emission of light as opposed to stimulated emission. LEDs usually have high bandwidth but relatively low power. LEDs operate in the infrared, visible and ultraviolet regions of the optical spectrum.
Lightguide
Synonym optical fiber
Loss
The amount of a signal's power, expressed in dB, that is lost in connectors, splices, or fiber defects.
FAQ
star
For additional product selection assistance,
tell us about your application and its specific design criteria and a technical service representative will contact you directly.
Spotlight
Featured Products
Press Releases
EPO-TEK Blog Posts
Video Tutorials
  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
    03-21  to  03-23 OFC 2917 Anaheim, CA
    05-02  to  05-02 iMAPS New England Tabletop Boxborough, MA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    05-23  to  05-25 SID 1145 Los Angeles, CA
    02-07  to  02-09 MD&M West 624 Anaheim, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Thailand
    Vietnam
    Date Event Booth Location
    2017
    04-25  to  04-27 Semicon Southeast Asia D1 Penang - Malaysia
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    03-29  to  03-30 LOPEC B0/403 Munich - Germany
    04-04  to  04-06 Medtec 1/1H45 Stuttgart - Germany
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    05-10  to  05-11 Lab-on-a-Chip and Microfluidics C16 Munich - Germany
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    04-26  to  04-27 Fraunhofer CAM Workshop 13 Halle - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    02-08  to  02-10 SEMICON Korea C 1778 Seoul - Korea
    04-05  to  04-07 NEPCON G123 Seoul - Korea
med.2.jpg