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EPO-TEK® Glossary Of Terms

 

Edge-Emitting Diode
An LED that emits light from its edge, producing more direction output than surface-emitting LED's that emit from their top surface.
Elasticity
That property of materials by virtue of which they tend to recover their original size and shape after deformation. Note-if the strain is proportional to the applied stress, the material is said to exhibit Hookean or ideal elasticity.
Elastomer
A material which at room temperature can be stretched repeatedly to at least twice its original length and, upon immediate release of the stress, will return with force to its approximate original length.
Elastomeric
A material that at room temperature can be stretched repeatedly to at least twice its original length, and upon release of the stress, will return with force to its approximate original length. A rubber band is an example.
Electrode
A conductor through which a current enters or leaves an electrolytic cell, vacuum tube, or any nonmetallic conductor.
Electrolytic Corrosion
Corrosion by means of electrochemical action.
Electromagnetic Interference
(EMI) Any electrical or electromagnetic interference tha causes undesirable response, degradation, or failure in electronic equipment. Optical fibers neither emit nor receive EMI.
Electromagnetic Radiation [EMR)
Radiation made up of oscillating electric and magnetic fields and propagated with the speed of light. Includes gamma radiation, X-rays, ultraviolet, visible and infrared radiation, and radar and radio waves.
Electromagnetic Spectrum
The range of frequencies of electromagnetic radiation from zero to infinity.
Electromigration
The electrolytic transfer of metal from one conductor to another conductor separated from the first conductor by a dielectric medium.
Electronic Packaging
The technology of interconnecting semiconductor and other electronic devices to provide an electronic function.
Electroplating
Deposition of metal onto a cathodic surface by passing DC current into an electrolytic solution.
Elongation (%)
Ability of a material to stretch or become longer.
EM
Abbreviation for electromagnetic.
EMI
Electromagnetic interference.
Emissivity
The ratio of the radiant energy emitted by a source to the radiant energy of a perfect radiating surface (black box) having an equivalent surface area with all other relevant conditions being the same.
Emulsion
A stable mixture of two or more immiscible liquids held in a suspension by small percentages of emulsifiers.
Encapsulant
The material used to cover COB devices to provide mechanical protection and to ensure reliability, typically an epoxy.
Encapsulation
The sealing or covering of an element or circuit for the purpose of mechanical and environmental protection.
Endoscope
A fiber optic bundle used for imaging and viewing inside the human body.
Epoxy
A thermosetting polymer containing the oxirane group.
Epoxy Resin
A material that forms straight chain thermoplastic and thermosetting resins. Epoxy resins have excellent mechanical properties and good dimensional stability.
Eutectic
The minimum melting point of a combination of two or more materials. The eutectic temperature of an alloy is always lower than the melting point of any of its individual constituents. The eutectic temperature is the particular temperature at which the eutectic occurs. Eutectic alloys, when heated, transform directly from a solid to a liquid and do not show any pasty regions. For example, eutectic solder paste has a composition of 63% tin (Sn) and 37% lead (Pb), and has a eutectic temperature of 183¼C.
Evacuation
The removal of entrained air from an epoxy system by vacuum. Also referred to as degassing.
Exotherm
The liberation of heat energy during a chemical reaction. Exotherm is increased in large masses.
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  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    05-23  to  05-25 SID 1145 Los Angeles, CA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    06-20  to  06-23 EPHJ/EPMT/SMT TBA Geneva - Switzerland
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    07-12  to  07-13 UK Semiconductors TBA Sheffield - UK
    07-13  to  07-15 China Electronics Fair West Show Chengdu - China
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    09-20  to  09-22 Medtec China K408 Shanghai - China
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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