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EPO-TEK® Glossary Of Terms

 

B-Stage
An intermediate stage in the reaction of certain thermosetting resins in which the material softens when heated and swells when in contact with certain liquids, but may not entirely fuse or dissolve. The resin in an uncured thermosetting system, is usually in this stage.
Backscattering
The return of a portion of scattered light to the input end of a fiber; the scattering of light in the direction opposite to its original propagation.
Baking Temperature
A temperature above 150°F.(65.6°C). Refers to curing materials at these elevated temperatures.
Ball Grid Array (BGA)
A leadless surface-mountable package in which solder ball interconnects cover the bottom surface of the package in a checkboard fashion. BGAs are reflow soldered to PCBs using a mass reflow process.
Bandwidth
The range of frequencies over which a particular instrument is designed to function within specified limits.
Bare Board
An unpopulated PCB.
Bend Radius
The smallest radius an optical fiber or fiber cable can bend before increased attenuation or breakage occurs.
Bending
Loss Attenuation caused by high-order modes radiating from the outside of a fiber optic waveguide which occur when the fiber is bent around a small radius. See also macrobending, microbending.
Birefringent
Having a refractive index that differs for light of different polarizations.
Bit
The smallest unit of information upon which digital communications are based; also an electrical or optical pulse that carries this information.
Board
An organic printed circuit card or board on which smaller components, cards, or modules can be mounted.
Bond
The union of materials by adhesives.
Bond Strength
The unit load applied in tension, compression, flexure, peel, impact, cleavage, or shear, required to break an adhesive assembly with failure occurring in or near the plane of the bond. Note-The term adherence is frequently used in place of bond strength.
Bonding
The joining of two materials. For instance, the attachment of a component to a substrate.
Bonding Pads
Copper traces, or pads, on a substrate to which leads are bonded. Dimensions and thermal path from the bonding pads must be properly designed to achieve uniform solder reflow.
Brookfield Viscosimeter
An instrument for measuring the viscosity of formulated adhesives under standard conditions of temperature.
Bubble
Internal void or a trapped globule of air or other gas.
Bump
A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.
Burn-In
The process in which a device is electrically stressed by subjecting it to an elevated temperature and voltage for an adequate period of time to cause the failure of a marginal device.
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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
    05-02  to  05-02 iMAPS New England Tabletop Boxborough, MA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    05-23  to  05-25 SID 1145 Los Angeles, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
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    Taiwan
    Thailand
    Turkey
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    Vietnam
    Date Event Booth Location
    2017
    04-25  to  04-27 Semicon Southeast Asia D1 Penang - Malaysia
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    07-13  to  07-15 China Electronics Fair West Show Chengdu - China
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
    03-29  to  03-30 LOPEC B0/403 Munich - Germany
    04-04  to  04-06 Medtec 1/1H45 Stuttgart - Germany
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    05-10  to  05-11 Lab-on-a-Chip and Microfluidics C16 Munich - Germany
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    04-26  to  04-27 Fraunhofer CAM Workshop 13 Halle - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    04-05  to  04-07 NEPCON G123 Seoul - Korea
    09-20  to  09-22 Medtec China K408 Shanghai - China
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