EPO-TEK 50th gold Logo


EPO-TEK® Glossary Of Terms

 

B-Stage
An intermediate stage in the reaction of certain thermosetting resins in which the material softens when heated and swells when in contact with certain liquids, but may not entirely fuse or dissolve. The resin in an uncured thermosetting system, is usually in this stage.
Backscattering
The return of a portion of scattered light to the input end of a fiber; the scattering of light in the direction opposite to its original propagation.
Baking Temperature
A temperature above 150°F.(65.6°C). Refers to curing materials at these elevated temperatures.
Ball Grid Array (BGA)
A leadless surface-mountable package in which solder ball interconnects cover the bottom surface of the package in a checkboard fashion. BGAs are reflow soldered to PCBs using a mass reflow process.
Bandwidth
The range of frequencies over which a particular instrument is designed to function within specified limits.
Bare Board
An unpopulated PCB.
Bend Radius
The smallest radius an optical fiber or fiber cable can bend before increased attenuation or breakage occurs.
Bending
Loss Attenuation caused by high-order modes radiating from the outside of a fiber optic waveguide which occur when the fiber is bent around a small radius. See also macrobending, microbending.
Birefringent
Having a refractive index that differs for light of different polarizations.
Bit
The smallest unit of information upon which digital communications are based; also an electrical or optical pulse that carries this information.
Board
An organic printed circuit card or board on which smaller components, cards, or modules can be mounted.
Bond
The union of materials by adhesives.
Bond Strength
The unit load applied in tension, compression, flexure, peel, impact, cleavage, or shear, required to break an adhesive assembly with failure occurring in or near the plane of the bond. Note-The term adherence is frequently used in place of bond strength.
Bonding
The joining of two materials. For instance, the attachment of a component to a substrate.
Bonding Pads
Copper traces, or pads, on a substrate to which leads are bonded. Dimensions and thermal path from the bonding pads must be properly designed to achieve uniform solder reflow.
Brookfield Viscosimeter
An instrument for measuring the viscosity of formulated adhesives under standard conditions of temperature.
Bubble
Internal void or a trapped globule of air or other gas.
Bump
A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.
Burn-In
The process in which a device is electrically stressed by subjecting it to an elevated temperature and voltage for an adequate period of time to cause the failure of a marginal device.
FAQ
star
For additional product selection assistance,
tell us about your application and its specific design criteria and a technical service representative will contact you directly.
Spotlight
Featured Products
Press Releases
EPO-TEK Blog Posts
Video Tutorials
  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    09-20  to  09-22 Medtec China K408 Shanghai - China
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
booth.jpg