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Complete List of Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
T6081 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Packaging Materials,
Semiconductor
Thermal
Oven
days
med
high
high
T7109 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
PCB Level Materials,
Solar
Thermal
Oven,
Snap
med
low
low
med
T7109-17 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Oven,
Room Temperature
short
low
med
med
T7109-18 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Oven,
Room Temperature
short
low
med
med
T7109-19 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Oven,
Room Temperature
short
low
med
high
T7109-20 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Oven
short
low
med
high
T7110 Glob Top,
Heat Sinking,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Oven,
Room Temperature
med
low
med
low
T7110-38 Glob Top,
Heat Sinking,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Room Temperature
short
med
med
med
T7139 Glob Top,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials
Thermal
Oven
long
med
med
med
T905-1 Heat Sinking,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Oven,
Room Temperature
short
low
low
med
T905-1 Black Circuit / Electronic Assembly,
Hybrids Microelectronics,
Potting
Thermal
Oven,
Room Temperature
quick
med
N/A
med
T905BN-3 Circuit / Electronic Assembly,
LEDs,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Oven
short
low
med
med
T905BN-4 Circuit / Electronic Assembly,
LEDs,
Non-Conductive,
PCB Level Materials,
Potting
Thermal
Room Temperature
quick
med
med
med
TD1001 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
low
med
high
TD1001-67 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
low
med
high
TH106-5 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
low
high
TH106-6 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
high
med
med
TJ1104-LH Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
days
high
med
high
TJ1183-LH Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
high
med
med
TJ2139-LH Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
low
med
TJ2183-LH Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
high
med
med
TV1002 Circuit / Electronic Assembly,
Non-Conductive,
Packaging Materials,
Wafer Level
Thermal
Oven
days
high
med
high
TV1003 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
low
high
TV1003-LV Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
med
high
TV2001 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
days
low
med
med
Compare Products
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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    sweden
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2018
    01-31  to  02-02 SEMICON Korea C762 Seoul - Korea
    03-14  to  03-15 LOPEC B0/403 Munich - Germany
    03-14  to  03-16 Electronica China 2018 E1 1012 Shanghai, China - China
    03-15  to  03-15 Power Electronics & Battery B2 Telford, West Midlands UK - UK
    03-15  to  03-18 West China Aerospace & Military Industry Exhibition C18-3 Xi'an City, Shaaxi Province, PRC - China
    03-22  to  03-22 BAM St. Hallle, Switzerland - Germany
    03-22  to  03-24 MECSPE Hall 6 Parma, Italy -
    04-25  to  04-26 CAM Halle - Germany
    05-15  to  05-17 OPTATEC Hall 3.0 Frankfurt - Germany
    05-15  to  05-18 Joining Technology A07:31 Jönköping, Sweden -
    06-21  to  06-24 Medicare Taiwan 2018 TBA Taipei City, Taiwan - Taiwan
    07-4  to  07-5 UK Semiconductors TBA Sheffield - UK
    08-29  to  08-31 Touch & Display Taiwan 2018 TBA Taipei City, Taiwan - Taiwan
    09-05  to  09-08 China International Optoelectronic Expo (CIOE) TBA Shenzhen - China
    09-25  to  09-28 Micronora TBA Besançon, France - France
    10-08  to  10-11 Bondexpo Stuttgart - Germany
    10-23  to  10-26 GLASSTEC Düsseldorf - Germany
    10-30  to  11-01 Advanced Engineering TBA NEC Birmingham - UK
    11-13  to  11-16 SEMICON Europa A4/161 München - Germany
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