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Complete List of Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
323LP-LH Ultra Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
323LP-T Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
low
med
330 Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven,
Snap
med
med
N/A
low
353ND Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
USP Class VI Approved,
Wafer Level
None
Oven,
Snap
med
med
N/A
med
353ND Black Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven,
Snap
med
med
N/A
med
353ND-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven,
Snap
short
high
N/A
med
353ND-LH Ultra Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven,
Snap
short
high
N/A
med
353ND-T Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven,
Snap
med
med
med
high
353ND-T Black Catheter Materials,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Underfill
None
Oven,
Snap
med
med
med
high
353ND-T1 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
high
353ND-T4 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
high
353ND-T5 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
med
354 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
USP Class VI Approved
None
Oven
days
high
N/A
low
354-T Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
USP Class VI Approved
None
Oven
days
high
med
med
360 Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Snap
med
med
N/A
low
360ST Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Snap
med
med
med
low
360T Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Snap
med
med
high
med
375 Catheter Materials,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Snap
med
high
N/A
med
375-T Catheter Materials,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Snap
med
high
med
med
377 Catheter Materials,
Endoscopes ,
Fiber Optic,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Semiconductor ,
USP Class VI Approved,
Wafer Level
None
Oven
long
high
N/A
low
377H Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor
Electrical
Oven
days
high
N/A
low
383ND Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
Semiconductor
None
Oven
med
high
N/A
med
383ND-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
383ND-LH Ultra Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven
long
high
N/A
med
430 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
med
high
N/A
high
Compare Products
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    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
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    Date Event Booth Location
    2017
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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