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Complete List of Products

 
Compare Products
Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
H70E Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven,
Snap
days
med
low
med
H70E-1 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
high
med
H70E-175 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-2 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-2 Unpigmented Circuit / Electronic Assembly,
Glob Top,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven,
Snap
days
med
low
med
H70E-2LC Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
high
med
H70E-4 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
high
H70E-TI Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-TI-LH Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
med
med
H70S Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
low
H72 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
low
med
H73 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
med
high
N/A
high
H74 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
med
high
H74-110 Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Snap
short
high
N/A
med
H74F Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
med
med
high
H74G Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
quick
high
low
high
H75 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
N/A
high
H77 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
low
med
H77 Black Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
med
med
H77S Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Underfill
Thermal
Oven
med
med
low
med
H77T Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials
Thermal
Oven
med
med
med
med
H81 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
H81A Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
HYB-353ND Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials
None
Oven,
UV Light
med
med
N/A
med
HYB-353ND-HV Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials
None
Oven,
UV Light
med
med
N/A
high
Compare Products
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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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