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General Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
509FM-1 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Room Temperature
short
low
N/A
low
730 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Medical Epoxies,
Non-Conductive,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
med
high
730 Black Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Medical Epoxies,
Non-Conductive,
PCB Level Materials
None
Oven,
Room Temperature
short
med
med
high
730-110 Catheter Materials,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
med
730-110 Black Catheter Materials,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Opto-Packaging,
Potting
None
Oven,
Room Temperature
short
med
N/A
med
731 Circuit / Electronic Assembly,
Non-Conductive,
Semiconductor
None
Oven,
Room Temperature
short
med
N/A
high
AP-100 Endoscopes ,
Fiber Optic,
Optical Materials,
Opto-Packaging
None
N/A
N/A
N/A
N/A
low
B1118-LH Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
Thermal
Oven
long
med
med
high
B9021 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials
None
Oven
days
med
med
med
B9101-2 Unfilled Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Underfill,
Wafer Level
None
Oven
days
med
N/A
low
GE116 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Semiconductor
None
Oven
days
med
med
high
GE120 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Solder Replacement
None
Oven
days
med
med
high
H54 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
None
Oven
med
med
med
med
H61-110 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
days
high
N/A
low
M10-D Circuit / Electronic Assembly,
Hybrids Microelectronics,
LCDs,
Opto-Packaging,
Semiconductor
None
Oven
days
med
high
med
OJ2116 Non-Conductive,
Optical Materials
None
Room Temperature
quick
med
N/A
N/A
PI Thinner None
N/A
N/A
N/A
N/A
low
T905-1 Black Circuit / Electronic Assembly,
Hybrids Microelectronics,
Potting
Thermal
Oven,
Room Temperature
quick
med
N/A
med
U300-2 Non-Conductive,
Underfill
None
Oven
days
high
N/A
med
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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    05-23  to  05-25 SID 1145 Los Angeles, CA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    06-20  to  06-23 EPHJ/EPMT/SMT TBA Geneva - Switzerland
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    07-12  to  07-13 UK Semiconductors TBA Sheffield - UK
    07-13  to  07-15 China Electronics Fair West Show Chengdu - China
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    09-20  to  09-22 Medtec China K408 Shanghai - China
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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