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General Assembly Applications

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
509FM-1 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Room Temperature
short
low
N/A
low
730 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Medical Epoxies,
Non-Conductive,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
med
high
730 Black Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Medical Epoxies,
Non-Conductive,
PCB Level Materials
None
Oven,
Room Temperature
short
med
med
high
730-110 Catheter Materials,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
med
730-110 Black Catheter Materials,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Opto-Packaging,
Potting
None
Oven,
Room Temperature
short
med
N/A
med
731 Circuit / Electronic Assembly,
Non-Conductive,
Semiconductor
None
Oven,
Room Temperature
short
med
N/A
high
AP-100 Endoscopes ,
Fiber Optic,
Optical Materials,
Opto-Packaging
None
N/A
N/A
N/A
N/A
low
B1118-LH Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
Thermal
Oven
long
med
med
high
B9021 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials
None
Oven
days
med
med
med
B9101-2 Unfilled Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Underfill,
Wafer Level
None
Oven
days
med
N/A
low
GE116 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Semiconductor
None
Oven
days
med
med
high
GE120 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Solder Replacement
None
Oven
days
med
med
high
H54 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
None
Oven
med
med
med
med
H61-110 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
days
high
N/A
low
M10-D Circuit / Electronic Assembly,
Hybrids Microelectronics,
LCDs,
Opto-Packaging,
Semiconductor
None
Oven
days
med
high
med
OJ2116 Non-Conductive,
Optical Materials
None
Room Temperature
quick
med
N/A
N/A
PI Thinner None
N/A
N/A
N/A
N/A
low
T905-1 Black Circuit / Electronic Assembly,
Hybrids Microelectronics,
Potting
Thermal
Oven,
Room Temperature
quick
med
N/A
med
U300-2 Non-Conductive,
Underfill
None
Oven
days
high
N/A
med
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