EPO-TEK 50th gold Logo


General Assembly Applications

 
Compare Products
Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
509FM-1 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Room Temperature
short
low
N/A
low
730 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Medical Epoxies,
Non-Conductive,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
med
high
730 Black Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Medical Epoxies,
Non-Conductive,
PCB Level Materials
None
Oven,
Room Temperature
short
med
med
high
730-110 Catheter Materials,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
med
730-110 Black Catheter Materials,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Opto-Packaging,
Potting
None
Oven,
Room Temperature
short
med
N/A
med
731 Circuit / Electronic Assembly,
Non-Conductive,
Semiconductor
None
Oven,
Room Temperature
short
med
N/A
high
AP-100 Endoscopes ,
Fiber Optic,
Optical Materials,
Opto-Packaging
None
N/A
N/A
N/A
N/A
low
B1118-LH Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
Thermal
Oven
long
med
med
high
B9021 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials
None
Oven
days
med
med
med
B9101-2 Unfilled Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Underfill,
Wafer Level
None
Oven
days
med
N/A
low
GE116 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Semiconductor
None
Oven
days
med
med
high
GE120 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Solder Replacement
None
Oven
days
med
med
high
H54 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
None
Oven
med
med
med
med
H61-110 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
days
high
N/A
low
M10-D Circuit / Electronic Assembly,
Hybrids Microelectronics,
LCDs,
Opto-Packaging,
Semiconductor
None
Oven
days
med
high
med
OJ2116 Non-Conductive,
Optical Materials
None
Room Temperature
quick
med
N/A
N/A
PI Thinner None
N/A
N/A
N/A
N/A
low
T905-1 Black Circuit / Electronic Assembly,
Hybrids Microelectronics,
Potting
Thermal
Oven,
Room Temperature
quick
med
N/A
med
U300-2 Non-Conductive,
Underfill
None
Oven
days
high
N/A
med
Compare Products
FAQ
star
For additional product selection assistance,
tell us about your application and its specific design criteria and a technical service representative will contact you directly.
Spotlight
Featured Products
Press Releases
EPO-TEK Blog Posts
Video Tutorials
  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
    03-21  to  03-23 OFC 2917 Anaheim, CA
    05-02  to  05-02 iMAPS New England Tabletop Boxborough, MA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    05-23  to  05-25 SID 1145 Los Angeles, CA
    02-07  to  02-09 MD&M West 624 Anaheim, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Thailand
    Vietnam
    Date Event Booth Location
    2017
    04-25  to  04-27 Semicon Southeast Asia D1 Penang - Malaysia
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    03-29  to  03-30 LOPEC B0/403 Munich - Germany
    04-04  to  04-06 Medtec 1/1H45 Stuttgart - Germany
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    05-10  to  05-11 Lab-on-a-Chip and Microfluidics C16 Munich - Germany
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    04-26  to  04-27 Fraunhofer CAM Workshop 13 Halle - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    02-08  to  02-10 SEMICON Korea C 1778 Seoul - Korea
    04-05  to  04-07 NEPCON G123 Seoul - Korea
med.3.jpg