EPO-TEK 50th gold Logo


Optical Products

 
Compare Products
Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
301 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
N/A
low
301-1 Catheter Materials,
Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
low
301-2 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Solar,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
med
med
N/A
low
301-2FL Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
long
low
N/A
low
301-2FL-CX Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
med
low
N/A
low
301-2FL-LY Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
long
low
N/A
low
301-2FL-T Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
med
low
med
low
301-2G Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
long
high
N/A
low
302 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
None
Room Temperature
quick
low
N/A
med
302-3M Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
N/A
low
302-3M Black Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
med
305 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310M Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310M Black Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
med
310M-1 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
USP Class VI Approved
None
Oven,
Room Temperature
med
low
N/A
low
310M-2 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310T-M Circuit / Electronic Assembly,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Room Temperature
short
low
med
low
314 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Underfill
None
Oven
days
med
N/A
low
320 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
high
low
320-3 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven
days
med
med
med
320LV Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
med
N/A
low
320NC Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
None
Room Temperature
short
low
N/A
low
320NC-2 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
None
Oven,
Room Temperature
short
low
med
low
323LP Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
323LP-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
Compare Products
FAQ
star
For additional product selection assistance,
tell us about your application and its specific design criteria and a technical service representative will contact you directly.
Spotlight
Featured Products
Press Releases
EPO-TEK Blog Posts
Video Tutorials
  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    09-20  to  09-22 Medtec China K408 Shanghai - China
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
mil.jpg