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Thermal Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
920 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
920-FL Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
921 Circuit / Electronic Assembly,
Hybrids Microelectronics,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
921-FL Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
930 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials
Thermal
Oven
med
med
N/A
high
930-1 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
long
med
med
high
930-4 Circuit / Electronic Assembly,
Fiber Optic,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar
Thermal
Oven
long
med
med
med
B1118-LH Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
Thermal
Oven
long
med
med
high
B9021-14 Heat Sinking,
LCDs
Thermal
Oven
long
low
med
med
B9021-15 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
high
high
B9126-7 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials
Thermal
Oven,
Snap
days
med
med
high
EK1000-1-D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
low
med
low
EV2118-1 Circuit / Electronic Assembly,
Electrically Conductive
Electrical
Oven
med
low
high
med
GD2191 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
days
med
med
med
H55 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
med
high
N/A
high
H61 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
low
high
H61LV Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
low
med
H61ND Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
med
med
H62 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
med
med
H63 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
low
med
H65-175MP Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
med
high
H67-MP Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Medical Epoxies,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
med
N/A
high
H67MP-GB Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
med
N/A
high
H67MP-T Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
N/A
high
H70E Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven,
Snap
days
med
low
med
Compare Products
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