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Thermal Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
H70E-175 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-2 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-2 Unpigmented Circuit / Electronic Assembly,
Glob Top,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven,
Snap
days
med
low
med
H70E-2LC Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
high
med
H70E-4 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
high
H70E-TI Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-TI-LH Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
med
med
H70S Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
low
H72 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
low
med
H73 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
med
high
N/A
high
H74 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
med
high
H74-110 Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Snap
short
high
N/A
med
H74F Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
med
med
high
H74G Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
quick
high
low
high
H75 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
N/A
high
H77 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
low
med
H77 Black Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
med
med
H77S Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Underfill
Thermal
Oven
med
med
low
med
H77T Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials
Thermal
Oven
med
med
med
med
M10-D Circuit / Electronic Assembly,
Hybrids Microelectronics,
LCDs,
Opto-Packaging,
Semiconductor
None
Oven
days
med
high
med
OE188-3 Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
quick
high
N/A
high
T-7 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
low
med
T6065 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials
Thermal
Oven
days
high
med
high
T6067 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials
Thermal
Oven
days
med
N/A
high
T6067-3 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials
Thermal
Oven
days
high
N/A
high
Compare Products
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