EPO-TEK 50th gold Logo


Electrical Assembly Applications

 
Compare Products
Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
H22 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
long
high
med
med
H24 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
long
high
low
med
H27D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
long
med
low
low
H31 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
med
high
H31D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
med
high
H31D-LV Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
low
med
H31LV Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
low
low
H35-175MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
med
med
H35-175MPLV Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
med
med
H35-175MPT Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
high
high
H37-MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
med
med
med
H37-MPT Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
med
high
high
H37MP-2 Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
high
med
high
H44 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
N/A
high
N/A
high
H81 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
H81A Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
N20E Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Electrical,
Thermal
Oven,
Snap
days
med
med
med
P10 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
med
med
P1011 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
med
med
P1011-ST Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor ,
Solder Replacement
Electrical
Oven
N/A
high
low
med
P1011S Circuit / Electronic Assembly,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
med
med
Compare Products
FAQ
star
For additional product selection assistance,
tell us about your application and its specific design criteria and a technical service representative will contact you directly.
Spotlight
Featured Products
Press Releases
EPO-TEK Blog Posts
Video Tutorials
  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
led.jpg