EPO-TEK Logo


Electrical Assembly Applications

 
Compare Products
Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
EK1000-1MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
high
med
high
EK1000-MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
low
EK2000 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven
long
high
med
low
EM127 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
low
EV2002 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven
med
med
med
high
EV2118-2 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
low
med
low
H20E Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20E-175 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
med
H20E-8 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
high
H20E-D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
high
low
H20E-FC Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
long
high
med
med
H20E-HC Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor
Electrical,
Thermal
Oven
days
med
med
med
H20E-LC Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20E-LV Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
low
H20E-MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
high
med
H20E-PFC Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
high
med
H20E-PFC-D Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
high
med
H20E-SLR Solar
Electrical,
Thermal
Oven,
Snap
long
med
med
med
H20E-SLR-HV Solar
Electrical,
Thermal
Oven,
Snap
long
med
med
med
H20E-SLR-HVMX Solar
Electrical,
Thermal
Oven,
Snap
long
med
med
med
H20E-SLR-MX Solar
Electrical,
Thermal
Oven,
Snap
long
med
high
med
H20F Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven
days
low
med
med
H20S Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20S-D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
high
low
H21D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
long
high
med
med
Compare Products
FAQ
star
For additional product selection assistance,
tell us about your application and its specific design criteria and a technical service representative will contact you directly.
Spotlight
Featured Products
Press Releases
EPO-TEK Blog Posts
Video Tutorials
  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    sweden
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2018
    01-31  to  02-02 SEMICON Korea C762 Seoul - Korea
    03-14  to  03-15 LOPEC B0/403 Munich - Germany
    03-14  to  03-16 Electronica China 2018 E1 1012 Shanghai, China - China
    03-15  to  03-15 Power Electronics & Battery B2 Telford, West Midlands UK - UK
    03-15  to  03-18 West China Aerospace & Military Industry Exhibition C18-3 Xi'an City, Shaaxi Province, PRC - China
    03-22  to  03-22 BAM St. Hallle, Switzerland - Germany
    03-22  to  03-24 MECSPE Hall 6 Parma, Italy -
    04-25  to  04-26 CAM Halle - Germany
    05-15  to  05-17 OPTATEC Hall 3.0 Frankfurt - Germany
    05-15  to  05-18 Joining Technology A07:31 Jönköping, Sweden -
    06-21  to  06-24 Medicare Taiwan 2018 TBA Taipei City, Taiwan - Taiwan
    07-4  to  07-5 UK Semiconductors TBA Sheffield - UK
    08-29  to  08-31 Touch & Display Taiwan 2018 TBA Taipei City, Taiwan - Taiwan
    09-05  to  09-08 China International Optoelectronic Expo (CIOE) TBA Shenzhen - China
    09-25  to  09-28 Micronora TBA Besançon, France - France
    10-08  to  10-11 Bondexpo Stuttgart - Germany
    10-23  to  10-26 GLASSTEC Düsseldorf - Germany
    10-30  to  11-01 Advanced Engineering TBA NEC Birmingham - UK
    11-13  to  11-16 SEMICON Europa A4/161 München - Germany
solar.jpg