EPO-TEK 50th gold Logo


Hybrid Microelectronics Assembly Applications

 
Compare Products
Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
302-3M Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
N/A
low
302-3M Black Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
med
314 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Underfill
None
Oven
days
med
N/A
low
320 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
high
low
320-3 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven
days
med
med
med
320LV Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
med
N/A
low
320NC Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
None
Room Temperature
short
low
N/A
low
320NC-2 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
None
Oven,
Room Temperature
short
low
med
low
323LP Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
323LP-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
323LP-LH Ultra Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
323LP-T Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
low
med
330 Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven,
Snap
med
med
N/A
low
353ND Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
USP Class VI Approved,
Wafer Level
None
Oven,
Snap
med
med
N/A
med
353ND Black Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven,
Snap
med
med
N/A
med
353ND-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven,
Snap
short
high
N/A
med
353ND-LH Ultra Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven,
Snap
short
high
N/A
med
353ND-T Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven,
Snap
med
med
med
high
353ND-T Black Catheter Materials,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Underfill
None
Oven,
Snap
med
med
med
high
353ND-T1 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
high
353ND-T4 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
high
353ND-T5 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
med
354 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
USP Class VI Approved
None
Oven
days
high
N/A
low
354-T Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
USP Class VI Approved
None
Oven
days
high
med
med
360 Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Snap
med
med
N/A
low
Compare Products
FAQ
star
For additional product selection assistance,
tell us about your application and its specific design criteria and a technical service representative will contact you directly.
Spotlight
Featured Products
Press Releases
EPO-TEK Blog Posts
Video Tutorials
  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
    05-02  to  05-02 iMAPS New England Tabletop Boxborough, MA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    05-23  to  05-25 SID 1145 Los Angeles, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    04-25  to  04-27 Semicon Southeast Asia D1 Penang - Malaysia
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    07-13  to  07-15 China Electronics Fair West Show Chengdu - China
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
    03-29  to  03-30 LOPEC B0/403 Munich - Germany
    04-04  to  04-06 Medtec 1/1H45 Stuttgart - Germany
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    05-10  to  05-11 Lab-on-a-Chip and Microfluidics C16 Munich - Germany
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    04-26  to  04-27 Fraunhofer CAM Workshop 13 Halle - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    04-05  to  04-07 NEPCON G123 Seoul - Korea
    09-20  to  09-22 Medtec China K408 Shanghai - China
mil.jpg