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Hybrid Microelectronics Assembly Applications

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
TJ2139-LH Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
low
med
TJ2183-LH Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
high
med
med
TV1003 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
low
high
TV1003-LV Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
med
high
TV2001 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
days
low
med
med
TZ101 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
low
med
high
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