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Medical Epoxies Assembly Applications

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
B9144 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
None
Oven,
Room Temperature
quick
low
N/A
low
CF6-2 Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Potting
None
Oven
long
high
N/A
low
E4110-PFC Circuit / Electronic Assembly,
Electrically Conductive,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
quick
low
med
high
H20E Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
USP Class VI Approved
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20E-175 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
med
H20E-8 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
high
H20E-FC Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
long
high
med
med
H20E-HC Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor
Electrical,
Thermal
Oven
days
med
med
med
H20E-LC Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20E-LV Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
low
H20S Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Medical Epoxies,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
Wafer Level
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H67-MP Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Medical Epoxies,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
Thermal
Oven
days
med
N/A
high
H70E-4 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
high
H77 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
low
med
H81 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
H81A Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
OD2002 Circuit / Electronic Assembly,
Glob Top,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor
None
Oven
med
high
N/A
high,
med
OE100T Circuit / Electronic Assembly,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor
None
Oven
med
med
high
med
OE121 Black Circuit / Electronic Assembly,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
Potting,
Semiconductor ,
Underfill
None
Oven,
Room Temperature
med
low
N/A
low
OE138 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Medical Epoxies,
Semiconductor
None
Oven,
Snap
med
med
low
med
OE184 Fiber Optic,
Medical Epoxies,
Opto-Packaging,
USP Class VI Approved
None
Oven,
Snap
quick
high
N/A
med
OE188 Circuit / Electronic Assembly,
Fiber Optic,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
Semiconductor ,
Underfill
None
Oven,
Snap
med
med
med
high
OG116-31 Circuit / Electronic Assembly,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
USP Class VI Approved
None
UV Light
N/A
high
low
high
OG603 Fiber Optic,
Medical Epoxies
None
UV Light
N/A
med
N/A
low
TJ1183-LH Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
high
med
med
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