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Semiconductor Assembly Applications

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
353ND Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
USP Class VI Approved,
Wafer Level
None
Oven,
Snap
med
med
N/A
med
353ND Black Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven,
Snap
med
med
N/A
med
353ND-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven,
Snap
short
high
N/A
med
353ND-LH Ultra Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven,
Snap
short
high
N/A
med
353ND-T Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven,
Snap
med
med
med
high
353ND-T Black Catheter Materials,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Underfill
None
Oven,
Snap
med
med
med
high
353ND-T1 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
high
353ND-T4 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
high
353ND-T5 Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
None
Oven,
Snap
med
med
med
med
377 Catheter Materials,
Endoscopes ,
Fiber Optic,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Semiconductor ,
USP Class VI Approved,
Wafer Level
None
Oven
long
high
N/A
low
377H Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor
Electrical
Oven
days
high
N/A
low
509FM-1 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Room Temperature
short
low
N/A
low
731 Circuit / Electronic Assembly,
Non-Conductive,
Semiconductor
None
Oven,
Room Temperature
short
med
N/A
high
920 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
920-FL Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
921 Circuit / Electronic Assembly,
Hybrids Microelectronics,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
921-FL Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
930-1 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
long
med
med
high
930-4 Circuit / Electronic Assembly,
Fiber Optic,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar
Thermal
Oven
long
med
med
med
B9021-15 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
high
high
B9144 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
None
Oven,
Room Temperature
quick
low
N/A
low
E2036 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
low
med
med
E2101 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
med
E3001 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
high
med
med
E3001-6 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
med
high
med
med
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  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
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    Date Event Booth Location
    2017
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    09-20  to  09-22 Medtec China K408 Shanghai - China
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
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    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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