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Semiconductor Assembly Applications

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
E3001-HV Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
long
high
med
med
E3037 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
med
E3037-LV Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
high
med
med
E4110 Circuit / Electronic Assembly,
Electrically Conductive,
LCDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
short
low
med
low
E4110-LV Circuit / Electronic Assembly,
Electrically Conductive,
LCDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
long
low
med
low
E4110-PFC Circuit / Electronic Assembly,
Electrically Conductive,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
quick
low
med
high
ED1020 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor
Electrical,
Thermal
Oven
days
med
med
low
EE149-6 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
high
med
med
EE165-3 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
long
low
med
med
EJ2108 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Electrical,
Thermal
Oven
short
low
med
med
EK1000 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven
long
med
med
low
EK1000-1 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
high
med
med
EK1000-1-D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
low
med
low
EK1000-1MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
high
med
high
EK1000-MP Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
low
EK2000 Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven
long
high
med
low
EM127 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
low
EV2002 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven
med
med
med
high
EV2118-2 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
low
med
low
H20E Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
USP Class VI Approved
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20E-175 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
med
med
med
H20E-D Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
high
low
H20E-FC Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
long
high
med
med
H20E-LC Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
med
H20E-LV Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven,
Snap
days
med
med
low
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