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Semiconductor Assembly Applications

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
OE121 Black Circuit / Electronic Assembly,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
Potting,
Semiconductor ,
Underfill
None
Oven,
Room Temperature
med
low
N/A
low
OE132-43 Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Semiconductor
None
Oven
days
high
N/A
low
OE138 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Medical Epoxies,
Semiconductor
None
Oven,
Snap
med
med
low
med
OE188 Circuit / Electronic Assembly,
Fiber Optic,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
Semiconductor ,
Underfill
None
Oven,
Snap
med
med
med
high
OE188-3 Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
quick
high
N/A
high
OG116-31 Circuit / Electronic Assembly,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
USP Class VI Approved
None
UV Light
N/A
high
low
high
OG133-7 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Semiconductor
None
UV Light
N/A
low
N/A
low
OG133-8 Circuit / Electronic Assembly,
Glob Top,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor
None
UV Light
N/A
low
high
low
OG154-1 Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
Semiconductor
None
UV Light
N/A
high
N/A
high
OG198-55 Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
Semiconductor
None
Oven,
UV Light
N/A
high
high
low
OG198-56 Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Semiconductor
None
UV Light
N/A
high
high
low
OH105-2 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven,
Room Temperature
quick
med
high
med
OJ2933-LH Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Semiconductor
None
Oven,
Snap
days
high
med
high
OM118 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Room Temperature
quick
high
N/A
low
P10 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
med
med
P1011 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
med
med
P1011-ST Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor ,
Solder Replacement
Electrical
Oven
N/A
high
low
med
P1011S Circuit / Electronic Assembly,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
med
med
PJ1390-1 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor ,
Wafer Level
None
Oven
days
N/A
N/A
low
T-7 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
low
med
T6081 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Packaging Materials,
Semiconductor
Thermal
Oven
days
med
high
high
TD1001-67 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
low
med
high
TH106-5 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
low
high
TH106-6 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
high
med
med
TJ1104-LH Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
days
high
med
high
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