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Complete List of Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
301 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
N/A
low
301-1 Catheter Materials,
Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
low
301-2 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Solar,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
med
med
N/A
low
301-2FL Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
long
low
N/A
low
301-2FL-CX Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
med
low
N/A
low
301-2FL-LY Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
long
low
N/A
low
301-2FL-T Circuit / Electronic Assembly,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
med
low
med
low
301-2G Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
LCDs,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
long
high
N/A
low
302 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
None
Room Temperature
quick
low
N/A
med
302-3M Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
N/A
low
302-3M Black Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
med
305 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310M Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310M Black Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
med
310M-1 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting,
USP Class VI Approved
None
Oven,
Room Temperature
med
low
N/A
low
310M-2 Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
low
N/A
low
310T-M Circuit / Electronic Assembly,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials
None
Oven,
Room Temperature
short
low
med
low
314 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
PCB Level Materials,
Underfill
None
Oven
days
med
N/A
low
320 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
high
low
320-3 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven
days
med
med
med
320LV Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Medical Epoxies,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting
None
Oven,
Room Temperature
short
med
N/A
low
320NC Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
None
Room Temperature
short
low
N/A
low
320NC-2 Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Wafer Level
None
Oven,
Room Temperature
short
low
med
low
323LP Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
323LP-LH Premium Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Underfill,
Wafer Level
None
Oven
long
high
N/A
med
Compare Products
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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2017
    07-11  to  07-13 Semicon West 5951 Nor San Francisco, CA
    05-02  to  05-02 iMAPS New England Tabletop Boxborough, MA
    06-06  to  06-08 Int'l Microwave Symposium 1901 Honolulu, HI
    05-23  to  05-25 SID 1145 Los Angeles, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    04-25  to  04-27 Semicon Southeast Asia D1 Penang - Malaysia
    06-21  to  06-24 Nepcon Thailand Bangkok - Thailand
    07-13  to  07-15 China Electronics Fair West Show Chengdu - China
    09-06  to  09-09 China International Optoelectronic Expo (CIOE) Shenzhen - China
    09-13  to  09-15 Nepcon Vietnam G2 Hanoi - Vietnam
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
    03-29  to  03-30 LOPEC B0/403 Munich - Germany
    04-04  to  04-06 Medtec 1/1H45 Stuttgart - Germany
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    06-26  to  06-29 LASER World of PHOTONICS B1/522 Munich - Germany
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    05-10  to  05-11 Lab-on-a-Chip and Microfluidics C16 Munich - Germany
    05-16  to  05-18 Smt Hybrid Packaging 5/411 Nuremberg - Germany
    04-26  to  04-27 Fraunhofer CAM Workshop 13 Halle - Germany
    05-17  to  05-18 TechnoBond Bad Hersfeld - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    06-21  to  06-23 PSECE 158/159/ Manila - Philippines
    07-28  to  07-29 CSECE 2 Cebu City - Philippines
    04-05  to  04-07 NEPCON G123 Seoul - Korea
    09-20  to  09-22 Medtec China K408 Shanghai - China
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